Microbattery with through-silicon via electrodes

    公开(公告)号:GB2565497B

    公开(公告)日:2021-10-06

    申请号:GB201819531

    申请日:2017-05-23

    Applicant: IBM

    Abstract: Batteries include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.

    All-silicon hermetic package and processing for narrow, low-profile microbatteries

    公开(公告)号:GB2556268A

    公开(公告)日:2018-05-23

    申请号:GB201801637

    申请日:2016-08-02

    Applicant: IBM

    Abstract: A microbattery structure (101) for hermetically sealed microbatteries is provided. The microbattery structure (101) includes a first silicon substrate (1001) containing at least one pedestal which houses a cathode material (1601) of a microbattery and at least one depression (1003, 1004) which houses a first sealant material (1301) of the microbattery, the structure further includes a second silicon substrate (201) containing at least one pedestal which houses an anode material (601) of the microbattery and at least one depression (202, 204) which houses a second sealant material (801) of the microbattery. An insulated centerpiece (1401) is bonded to the first sealant material (1301) present in at least two depressions (202,204) on the first silicon substrate (1001). An interlock structure is formed by aligning and superimposing the second silicon substrate (201) on the first silicon substrate (1001) in a mortise and tenon fashion and sealing the two substrates (1001, 201) using a high force.

    All-silicon hermetic package and processing for narrow, low-profile microbatteries

    公开(公告)号:GB2556268B

    公开(公告)日:2018-12-26

    申请号:GB201801637

    申请日:2016-08-02

    Applicant: IBM

    Abstract: A microbattery structure for hermetically sealed microbatteries is provided. In one embodiment, the microbattery structure includes a first silicon substrate containing at least one pedestal which houses a cathode material of a microbattery and at least one depression which houses A FIRST sealant material of the microbattery. The structure further includes a second silicon substrate containing at least one pedestal which houses an anode material of the microbattery and at least one depression which houses a second sealant material of the microbattery. An insulated centerpiece is bonded to the first sealant material present in at least two depressions on the first silicon substrate. An interlock structure is formed by aligning and superimposing the second silicon substrate on the first silicon substrate in a mortise and tenon fashion and sealing the two substrates using a high force.

    Helical coil delivery device for active agent

    公开(公告)号:GB2553612A

    公开(公告)日:2018-03-14

    申请号:GB201708287

    申请日:2015-10-28

    Applicant: IBM

    Inventor: BUCKNELL WEBB

    Abstract: A delivery device includes a substrate (201) formed in a coil (200); a plurality of cavities (202) for holding an active agent, the cavities (202) disposed along a length of the substrate (201) between an inner surface (304) and an outer surface (305) of the substrate (201) formed in the coil (200); and a plurality of seals (204) defining a closed volume of the cavities (202), wherein the seals (204) are configured for sequential opening of the cavities (202).

    Microbattery with through-silicon via electrodes

    公开(公告)号:GB2565497A

    公开(公告)日:2019-02-13

    申请号:GB201819531

    申请日:2017-05-23

    Applicant: IBM

    Abstract: Batteries and methods of forming the same include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.

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