公开(公告)号：AT535013T

公开(公告)日：2011-12-15

申请号：AT06740771

申请日：2006-04-07

Applicant: IBM

Inventor： YANG CHIH-CHAO ,  CLEVENGER LAWRENCE ,  COWLEY ANDREW ,  DALTON TIMOTHY ,  YOON MEEYOUNG

IPC: H01L21/4763 ,  H01L21/768

Abstract: A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner.