1.
    发明专利
    未知

    公开(公告)号:DE3577022D1

    公开(公告)日:1990-05-10

    申请号:DE3577022

    申请日:1985-11-19

    Applicant: IBM

    Abstract: The invention is directed to integrated circuit chips and particularly to "gate array", or "master slices" whereon one or more circuits (IC1...IC5) drive a highly capacitive on-chip wiring (H, IC6) net. The driving circuits are modified and a compensation circuit (CC; R1, T1) coupled to the highly capacitive on-chip wiring net to mitigate the burden caused by the high capacitance. The integrated circuit structure contains, efficiently positioned on each chip, a number of compensation circuits which are readily connectable during the fabrication of the chip. The employment of one, or a number of, on-chip compensation circuits does not materially increase the chip power consumption.

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