公开(公告)号：JPH1125994A

公开(公告)日：1999-01-29

申请号：JP11204198

申请日：1998-04-22

Applicant: IBM

Inventor： JOHN M COTTE ,  DATTA MADHAV ,  LAVINDLA SHENOI

IPC: H01M2/02 ,  H01M4/06 ,  H01M6/18 ,  H01M6/22

Abstract: PROBLEM TO BE SOLVED: To provide a solid polymer electrolyte battery by containing lithium salt and organic non-proton solvent in electrolyte and preparing organic non- proton solvent solution by specified amounts of ethylene carbonate, propylene carbonate and gamma butyloractone. SOLUTION: A polymer spacer 20 joins and seals the exposed peripheral edge of a polymer sheet 22, and forms a cavity for completely surrounding and enveloping a lithium foil negative electrode 14, an electrolyte film 16 and a positive electrode 18. For the electrolyte film 16, polyacrylonitrile is used, and electrolyte made of lithium salt solution and non-proton organic solvent is dispersed in the matrix of a polymer binder. For forming the positive electrode 18, a carbon such as manganese dioxide, activated charcoal, or carbon black is introduced to the solution of an electrolyte film material using polyacrylonitrile as a base. The positive electrode contains about 50 to 70 wt.% of manganese dioxide and about 2 wt.% of carbon in a capsule sealing matrix.

公开(公告)号：JPH1116580A

公开(公告)日：1999-01-22

申请号：JP15973098

申请日：1998-06-08

Applicant: IBM

Inventor： JOHN M COTTE ,  DATTA MADHAV

IPC: H01M4/62 ,  H01M2/02 ,  H01M2/16 ,  H01M4/06 ,  H01M4/66 ,  H01M6/12 ,  H01M6/16 ,  H01M6/18

Abstract: PROBLEM TO BE SOLVED: To provide a primary lithium battery especially suitable to a stored type self-powered device(SSPD) for a mobile communication.computing device. SOLUTION: This battery is provided with an anode 14 and a flexible.polymer composite cathode 18 containing a manganese dioxide, carbon and an electrolyte contained in a polymer.binder. The electrolyte contains a lithium salt and an organic aprotic solvent solution, and the organic aprotic solvent solution contains an ethylene carbonate, a propylene carbonate and γ-butylolactone.

公开(公告)号：DE69506948T2

公开(公告)日：1999-07-29

申请号：DE69506948

申请日：1995-05-17

Applicant: IBM

Inventor： DATTA MADHAV ,  SHENOY RAVINDRA VAMAN

IPC: C23F1/26 ,  C23F1/44 ,  H01L21/28 ,  H01L21/306 ,  H01L21/3213 ,  H01L21/60 ,  H01L23/485

公开(公告)号：DE69207888T2

公开(公告)日：1996-08-14

申请号：DE69207888

申请日：1992-11-28

Applicant: IBM

Inventor： DATTA MADHAV ,  ROMANKIW LUBOMYR TARAS

IPC: B23H3/04 ,  C25F7/00 ,  C25F3/14

Abstract: The invention relates to an electropolishing tool for the removal of metal from a workpiece (22), said electropolishing tool comprising a container means (10) for retaining an electrolytic solution (12), a cathode assembly (18) in the shape of a pyramid the height of which is adjustable, a power supply means including a negative terminal and a positive terminal with said negative terminal being electrically connectable to said cathode assembly (18), a plate means (14) for holding the workpiece (22) and for forming an electrical connection to the workpiece, said plate means connected to the positive terminal of said power supply means, and an enclosure means (16) placed over the workpiece (22) leaving only the surface of the workpiece which is to be polished exposed to the electrolytic solution such that when the workpiece is secured to said plate means and said cathode assembly is connected to the negative terminal of said power supply means and is placed over the said enclosure means directly facing the workpiece enclosed therein, that portion of the workpiece exposed to the electrolytic solution undergoes electropolishing.

公开(公告)号：DE69207888D1

公开(公告)日：1996-03-07

申请号：DE69207888

申请日：1992-11-28

Applicant: IBM

Inventor： DATTA MADHAV ,  ROMANKIW LUBOMYR TARAS

IPC: B23H3/04 ,  C25F7/00 ,  C25F3/14

Abstract: The invention relates to an electropolishing tool for the removal of metal from a workpiece (22), said electropolishing tool comprising a container means (10) for retaining an electrolytic solution (12), a cathode assembly (18) in the shape of a pyramid the height of which is adjustable, a power supply means including a negative terminal and a positive terminal with said negative terminal being electrically connectable to said cathode assembly (18), a plate means (14) for holding the workpiece (22) and for forming an electrical connection to the workpiece, said plate means connected to the positive terminal of said power supply means, and an enclosure means (16) placed over the workpiece (22) leaving only the surface of the workpiece which is to be polished exposed to the electrolytic solution such that when the workpiece is secured to said plate means and said cathode assembly is connected to the negative terminal of said power supply means and is placed over the said enclosure means directly facing the workpiece enclosed therein, that portion of the workpiece exposed to the electrolytic solution undergoes electropolishing.

公开(公告)号：SG73521A1

公开(公告)日：2000-06-20

申请号：SG1998001454

申请日：1998-06-18

Applicant: IBM

Inventor： COTTE JOHN M ,  DATTA MADHAV ,  SHENOY RAVINDRA

IPC: H01M2/02 ,  H01M4/06 ,  H01M6/18 ,  H01M6/22 ,  H01M4/50

公开(公告)号：DE69208348D1

公开(公告)日：1996-03-28

申请号：DE69208348

申请日：1992-12-07

Applicant: IBM

Inventor： DATTA MADHAV ,  ROMANKIW LUBOMYR TARAS

IPC: C25F3/06 ,  C23F1/02 ,  C25F3/14 ,  C25F7/00 ,  H01G13/00 ,  H05K3/07

Abstract: The present invention describes a high speed, high precision electrochemical micromachining tool, chemical solution and method for the one sided through-mask micropatterning of conducting foils and films supported by insulating material. The tool of the present invention can include either a movable plate means allowing for the movement of the workpiece (20) to and from above the cathode assembly (18), or a movable cathode assembly means allowing for the movement of said cathode assembly to and fro beneath the workpiece. Said cathode assembly also consists of a nozzle assembly from which the electrolytic solution emerges as electrolytic shower and impinges upon the workpiece. Methods to resolve the problems related to the loss of electrical contact during the electrochemical micromachining process are also described.

公开(公告)号：DE69506948D1

公开(公告)日：1999-02-11

申请号：DE69506948

申请日：1995-05-17

Applicant: IBM

Inventor： DATTA MADHAV ,  SHENOY RAVINDRA VAMAN

IPC: C23F1/26 ,  C23F1/44 ,  H01L21/28 ,  H01L21/306 ,  H01L21/3213 ,  H01L21/60 ,  H01L23/485

公开(公告)号：SG55361A1

公开(公告)日：1998-12-21

申请号：SG1997002904

申请日：1997-08-11

Applicant: IBM

Inventor： COTTE JOHN M ,  DATTA MADHAV ,  SHENOY RAVINDRA

IPC: H01M4/06 ,  H01M4/50 ,  H01M4/62 ,  H01M4/66 ,  H01M6/12 ,  H01M6/16 ,  H01M6/18 ,  H01M6/22 ,  H01M6/50 ,  H01M6/02 ,  H01M6/06

公开(公告)号：DE69208348T2

公开(公告)日：1996-09-19

申请号：DE69208348

申请日：1992-12-07

Applicant: IBM

Inventor： DATTA MADHAV ,  ROMANKIW LUBOMYR TARAS

IPC: C25F3/06 ,  C23F1/02 ,  C25F3/14 ,  C25F7/00 ,  H01G13/00 ,  H05K3/07

Abstract: The present invention describes a high speed, high precision electrochemical micromachining tool, chemical solution and method for the one sided through-mask micropatterning of conducting foils and films supported by insulating material. The tool of the present invention can include either a movable plate means allowing for the movement of the workpiece (20) to and from above the cathode assembly (18), or a movable cathode assembly means allowing for the movement of said cathode assembly to and fro beneath the workpiece. Said cathode assembly also consists of a nozzle assembly from which the electrolytic solution emerges as electrolytic shower and impinges upon the workpiece. Methods to resolve the problems related to the loss of electrical contact during the electrochemical micromachining process are also described.