公开(公告)号：EP2232548A4

公开(公告)日：2013-02-27

申请号：EP08866597

申请日：2008-12-22

Applicant: IBM

Inventor： BASKER VEERARAGHAVAN S ,  PARUCHURI VAMSI ,  COTTE JOHN M ,  FURUKAWA TOSHIHARU ,  TONTI WILLIAM ,  DELIGIANNI HARIKLIA

IPC: H01L21/8238 ,  H01L29/66

CPC classification number: H01L21/823842 ,  H01L29/517 ,  H01L29/66545

公开(公告)号：EP1841558A4

公开(公告)日：2012-04-04

申请号：EP05852628

申请日：2005-12-02

Applicant: IBM

Inventor： ANDRICACOS PANAYOTIS C ,  CANAPERI DONALD F ,  COOPER ENAMUEL I ,  COTTE JOHN M ,  DELIGIANNI HARIKLIA ,  ECONOMIKOS LAERTIS ,  EDELSTEIN DANIEL C ,  FRANZ SILVIA ,  PRANATHARTHIHARAN BALASUBRAMANIAN ,  KRISHNAN MAHADEVAIYER ,  MANSSON ANDREW P ,  WALTON ERICK G ,  WEST ALAN C

IPC: B23H3/00 ,  B23H5/08

CPC classification number: C25F3/02 ,  B23H5/08 ,  C09G1/04 ,  H01L21/32125

公开(公告)号：EP1560949A4

公开(公告)日：2007-02-28

申请号：EP03783387

申请日：2003-11-14

Applicant: IBM

Inventor： ECONOMIKOS LAERTIS ,  DELIGIANNI HARIKLIA ,  COTTE JOHN M ,  GRABARZ HENRY J ,  CHEN BOMY

IPC: C25D5/48 ,  C25D7/12 ,  H01L21/288 ,  H01L21/321 ,  H01L21/768 ,  C25D5/22 ,  C25D17/00

CPC classification number: C25D7/123 ,  C25D5/48 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/7684 ,  Y10S205/917

Abstract: A method and apparatus are described for performing both electroplating of a metal layer and CMP planarization of the layer on a substrate. The apparatus includes a table (10) supporting a polishing pad (20); the table and pad have a plurality of holes (210, 220) forming channels for dispensing an electroplating solution onto the pad. Electroplating anodes (201, 202, 203) are disposed in the channels and in contact with the electroplating solution. A carrier (12) holds the substrate (1) substantially parallel to the top surface of the pad (20) and applies variable mechanical force on the substrate against the pad, so that the spacing between substrate and pad may be less during electroplating than during electroetching.

公开(公告)号：JP2005217419A

公开(公告)日：2005-08-11

申请号：JP2005021309

申请日：2005-01-28

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： EDELSTEIN DANIEL C ,  ANDRICACOS PANAYOTIS C ,  COTTE JOHN M ,  DELIGIANNI HARIKLIA ,  MAGERLEIN JOHN H ,  PETRARCA KEVIN S ,  STEIN KENNETH JAY ,  VOLANT RICHARD P

IPC: H01F41/04 ,  H01F17/00 ,  H01L21/02 ,  H01L23/485 ,  H01L23/522 ,  H01L23/532 ,  H01L27/08

CPC classification number: H01L24/12 ,  H01L23/5227 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L27/08 ,  H01L28/10 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05007 ,  H01L2224/05014 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05084 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an inductor and a method of forming the inductor. SOLUTION: The method of forming the inductor comprises (a) a step for providing a semiconductor substrate, (b) a step for forming a dielectric layer on the surface of the substrate, (c) a step for forming a lower trench in the dielectric layer, (d) a step for forming a resist layer on the surface of the dielectric layer, (e) a step for forming an upper trench which is aligned to the lower trench and whose bottom is opened for the lower trench in the resist layer, and (f) a step for completely filling the lower trench with a conductor and at least partially filling the upper trench with the conductor to form the inductor. The semiconductor structure includes the inductor including the upper surface, bottom surface and sidewall and a means that allows the inductor to be electrically contacted, the lower section of the inductor is extended by a distance that the lower section of the inductor is fixed in the dielectric layer formed on the substrate, and the upper section thereof is extended on the dielectric layer. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供电感器和形成电感器的方法。 形成电感器的方法包括（a）提供半导体衬底的步骤，（b）在衬底的表面上形成电介质层的步骤，（c）形成下沟槽的步骤 在电介质层中，（d）在电介质层的表面上形成抗蚀剂层的步骤，（e）形成上沟槽的步骤，该上沟槽与下沟槽对准并且底部为下沟槽开口 抗蚀剂层，和（f）用导体完全填充下沟槽并且至少部分地用导体填充上沟槽以形成电感器的步骤。 半导体结构包括电感器，其包括上表面，底表面和侧壁，以及允许电感器电接触的装置，电感器的下部延伸一段距离，电感器的下部固定在电介质中 层，其上部在电介质层上延伸。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：WO2006088533A3

公开(公告)日：2007-09-27

申请号：PCT/US2005043464

申请日：2005-12-02

Applicant: IBM ,  ANDRICACOS PANAYOTIS C ,  CANAPERI DONALD F ,  COOPER EMANUEL I ,  COTTE JOHN M ,  DELIGIANNI HARIKLIA ,  ECONOMIKOS LAERTIS ,  EDELSTEIN DANIEL C ,  FRANZ SILVIA ,  PRANATHARTHIHARAN BALASUBRAMAN ,  KRISHNAN MAHADEVAIYER ,  MANSSON ANDREW P ,  WALTON ERICK G ,  WEST ALAN C

Inventor： ANDRICACOS PANAYOTIS C ,  CANAPERI DONALD F ,  COOPER EMANUEL I ,  COTTE JOHN M ,  DELIGIANNI HARIKLIA ,  ECONOMIKOS LAERTIS ,  EDELSTEIN DANIEL C ,  FRANZ SILVIA ,  PRANATHARTHIHARAN BALASUBRAMAN ,  KRISHNAN MAHADEVAIYER ,  MANSSON ANDREW P ,  WALTON ERICK G ,  WEST ALAN C

IPC: B23H3/00

CPC classification number: C25F3/02 ,  B23H5/08 ,  C09G1/04 ,  H01L21/32125

Abstract: Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations.

Abstract translation: 提供了诸如铜之类的硅芯片互连材料的电化学机械抛光（e-CMP）的方法和组合物。 所述方法包括使用根据本发明的组合物与具有各种构型的垫组合。

公开(公告)号：JP2004200658A

公开(公告)日：2004-07-15

申请号：JP2003383178

申请日：2003-11-12

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： COTTE JOHN M ,  IVERS CATHERINE ,  MCCULLOUGH KENNETH J ,  MOREAU WAYNE M ,  PURTELL ROBERT J ,  SIMONS JOHN P ,  SYVERSON WILLIAM A ,  TAFT CHARLES J

IPC: H01L21/304 ,  B08B7/00 ,  C25F1/00 ,  H01L21/30 ,  H01L21/302 ,  H01L21/306

CPC classification number: B08B7/0021 ,  H01L21/02063 ,  Y10S134/902

Abstract: PROBLEM TO BE SOLVED: To provide a method and device for removing a solid residual or a liquid residual, or both of them, from an electronic component such as a semiconductor wafer or the like.
SOLUTION: The residual is solidified on the surface of the wafer by the use of liquid or a supercritical carbon dioxide, and then the residual is removed by vaporization from the system. In a favorable embodiment, after the solidifying step and the vaporizing step are repeated (cycled), the CO
2 is removed from a vessel. The residual is removed with the vaporizing carbon dioxide.
COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2004162177A

公开(公告)日：2004-06-10

申请号：JP2003348876

申请日：2003-10-07

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： ECONOMIKOS LAERTIS ,  DELIGIANNI HARIKLIA ,  COTTE JOHN M ,  ANDRICACOS PANAYOTIS C

IPC: C25D5/04 ,  C25D5/48 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00 ,  C25F3/12 ,  C25F7/00 ,  H01L21/288

CPC classification number: C25D5/48 ,  C25D17/00 ,  C25D17/001 ,  C25D17/10

Abstract: PROBLEM TO BE SOLVED: To provide an integrated plating and planarization apparatus having a counter electrode with a variable diameter.
SOLUTION: The apparatus for plating and planarizing a metal on a substrate is provided with a plurality of distribution segments each of which has at least one hole for distributing an electroplating solution onto the substrate. The distribution segments form a circular counter electrode and is movable with respect to each other during an electroplating process so that the counter electrode may have a variable diameter. Thus, the electroplating solution is distributed onto the annular part of the substrate having a diameter corresponding to the diameter of the counter electrode. Therefore, the counter electrode can allow the local delivery of the plating solution onto the substrate.
COPYRIGHT: (C)2004,JPO

公开(公告)号：DE112010004190T5

公开(公告)日：2012-11-29

申请号：DE112010004190

申请日：2010-07-29

Applicant: IBM

Inventor： COTTE JOHN M ,  JAHNES CHRISTOPHER V ,  PEN HONGBO ,  ROSSNAGEL STEPHEN M

IPC: G01R27/26 ,  G01N27/60

Abstract: Ein Filter umfasst eine Membran, welche mehrere darin ausgebildete Nanokanäle (14) aufweist. Ein erstes Oberflächenladungsmaterial (18) ist auf einen Endabschnitt der Nanokanäle aufgebracht. Das erste Oberflächenladungsmaterial umfasst eine Oberflächenladung, um Ionen in einer elektrolytischen Lösung (20) derart elektrostatisch zu beeinflussen, dass die Nanokanäle Ionen in die elektrolytische Lösung zurückweisen, während ein Fluid der elektrolytischen Lösung durchgelassen wird. Es werden auch Verfahren zur Herstellung und Verwendung des Filters bereitgestellt.

公开(公告)号：AU2003290804A1

公开(公告)日：2004-06-15

申请号：AU2003290804

申请日：2003-11-14

Applicant: IBM

Inventor： ECONOMIKOS LAERTIS ,  DELIGIANNI HARIKLIA ,  COTTE JOHN M ,  GRABARZ HENRY J ,  CHEN BOMY

IPC: C25D5/48 ,  C25D7/12 ,  H01L21/288 ,  H01L21/321 ,  H01L21/768 ,  C25D5/22 ,  C25D17/00

Abstract: A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.

公开(公告)号：GB2488928B

公开(公告)日：2014-04-02

申请号：GB201209216

申请日：2010-07-29

Applicant: IBM

Inventor： COTTE JOHN M ,  JAHNES CHRISTOPHER V ,  PENG HONGBO ,  ROSSNAGEL STEPHEN M

IPC: B01D67/00 ,  B01D71/02 ,  G01N27/60 ,  G01R27/26