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    Printed circuit structure and method for laminating circuit board
    1.
    发明专利
    Printed circuit structure and method for laminating circuit board 有权
    印刷电路结构和层叠电路板的方法

    公开(公告)号：JP2003309355A

    公开(公告)日：2003-10-31

    申请号：JP2003097669

    申请日：2003-04-01

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

    Inventor： DAY RICHARD ALLEN ,  KNADLE KEVIN TAYLOR ,  STAUFFER KRISTEN ANN

    IPC: H05K1/02 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

    CPC classification number: H05K1/0242 ,  H05K3/382 ,  H05K3/384 ,  H05K3/385 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2203/0315 ,  H05K2203/0361 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T428/24917 ,  Y10T428/24942

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit structure, with which an efficient signal transparent characteristic and appropriate adhesive strength are obtained. SOLUTION: A printed wiring board consists of two or more layers. One layer has a circuit line formed on the layer. In a surface of the circuit line, only a region where proper adhesive force of copper/laminated plate is requested is made rough. A remaining part of a circuit line face is smooth. Thus, a region for signal transport on a signal line makes the circuit line to be smooth, and signal transport effect is made maximal. The region, where signal transport is not important, becomes rough and improves the adhesive force of one layer with the other layer. In a voltage layer 26, a face on a region facing a smooth face of the signal layer 10 is smooth. Consequently, the regions of the voltage layer 26 are maintained smooth, but the other region on the surface of the voltage layer 26 is made rough, and satisfactory adhesive force is given to a contacted dielectric. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：提供一种印刷电路结构，其具有有效的信号透明特性和适当的粘合强度。

    解决方案：印刷电路板由两层或多层组成。 一层在层上形成电路线。 在电路线的表面，仅需要铜/层压板的适当粘合力的区域变得粗糙。 电路线面的剩余部分光滑。 因此，在信号线上进行信号传输的区域使得电路线路平滑，并且使信号传输效果最大化。 信号传输不重要的区域变得粗糙，提高了一层与另一层的粘合力。 在电压层26中，面对信号层10的平滑面的区域是平滑的。 因此，电压层26的区域保持平滑，但是电压层26的表面上的其他区域变得粗糙，并且对接触的电介质施加令人满意的粘合力。 版权所有（C）2004，JPO

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