公开(公告)号：US6360938B2

公开(公告)日：2002-03-26

申请号：US79459701

申请日：2001-02-27

Applicant: IBM

Inventor： DELAURENTIS STEPHEN A ,  INTERRANTE MARIO J ,  JACKSON RAYMOND A ,  KNICKERBOCKER JOHN U ,  RAY SUDIPTA K ,  STALTER KATHLEEN A

IPC: B23K1/018 ,  H01L21/687 ,  B23K31/02

CPC classification number: H01L21/687 ,  B23K1/018

Abstract: A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bi-metallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.

Abstract translation: 一种用于通过在将模块加热到足以导致的温度的温度下向一个或多个倒装芯片的背面施加张力而将一个或多个去除构件施加拉力而移除通过安装在多芯片模块上的C4接头的倒装芯片的方法和装置 C4接头变得熔化。 张力可以是压缩弹簧，也可以是在室温下为平坦的双金属构件，在加热到这样的温度时变得弯曲，或者是原始形状弯曲并在室温下弯曲平坦但是返回的记忆合金 在加热到这样的温度时变成原来的弯曲形状。 使用粘合剂将去除构件粘合到要去除的芯片上，并且是固化后具有耐高温性的低温快速固化粘合剂。

公开(公告)号：JP2002373923A

公开(公告)日：2002-12-26

申请号：JP2002131146

申请日：2002-05-07

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

Inventor： JACKSON RAYMOND A ,  BRADLEY SCOTT A ,  DELAURENTIS STEPHEN A ,  INTERRANTE MARIO J ,  LINNELL DAVID C

IPC: H01L21/60 ,  B08B1/00 ,  B08B7/00 ,  B23K1/018 ,  H01L21/48 ,  H05K3/34

CPC classification number: B08B1/008 ,  B08B7/0071 ,  H01L21/4864 ,  H05K3/3436 ,  H05K3/3457

Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for removing BGA interconnections from a substrate and an interposer for rework.
SOLUTION: The method for removing at least one molten or solid structure from a surface is provided with the step of placing the surface with the at least one molten or solid structure in a fixture, the step of disposing a wiper block assembly made to act by bias at a region at least proximally to one molten or solid structure, the step of retaining the wiper block assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure, and the step of raising the temperature of the fixture to the first temperature point level. When the device reaches the first temperature point level, at least the one molten or solid structure is wiped off from the surface.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供一种用于从基板和插入件去除BGA互连以进行返工的方法和装置。 解决方案：从表面去除至少一个熔融或固体结构的方法具有将具有至少一个熔融或固体结构的表面放置在固定装置中的步骤，将设置为由 在至少近似于一个熔融或固体结构的区域处的偏压，将刮水块组件保持在第一位置的步骤，其中装置具有等于或高于所述至少一个的第二熔点水平的第一温度点水平 熔融或固体结构，以及将夹具的温度升高到第一温度点的步骤。 当装置达到第一温度点时，至少将一个熔融或固体结构从表面擦掉。