公开(公告)号：JPH05211249A

公开(公告)日：1993-08-20

申请号：JP11070592

申请日：1992-04-03

Applicant: IBM

Inventor： GUNANARINGAMU AAJIYABARINGAMU ,  ARINA DOICHIE ,  FUADO ERIASU DOANII ,  BURUUSU KENESU FUAAMAN ,  DONARUDO JIYON HANTO ,  CHIYANDORASEKAA NARAYAN ,  MODESUTO MAIKERU OPURISUKO ,  SANPASU PURUSHIYOSAMAN ,  BINSENTO RANIERI ,  SUTEFUAN RENITSUKU ,  JIEEN MAAGARETSUTO SHIYOO ,  JIYANUSU SUTANISUROU UIRUKUJIN ,  DEBITSUTO FURANKU UITSUTOMAN

IPC: B23K26/00 ,  B32B37/00 ,  H01L21/68 ,  H01L23/12 ,  H01L23/15 ,  H05K3/00 ,  H05K3/46

Abstract: PURPOSE: To enable simultaneous manufacture of a multi-layered thin-film interconnection structure and a ceramic substrate with a good yield by forming on a transmitting substrate a separation layer which is less formed, when reacted with a predetermined electromagnetic radiation. CONSTITUTION: A polymer layer 2 is cut off by applying an ultraviolet light 10 from a scanning layer, via a transmitting substrate 1 to the polymer layer 2. Since a metallic layer 3 acts as a reflecting layer, the ultraviolet light 10 cannot reach an interconnection structure 4. As a result of the laser cut-off, monomer pieces, that is, an emitted substance gas is trapped between the substrate 1 and reflecting metal layer 3, thus forming voids 15 within the polymer layer 2. The polymer layer 2 is formed less due to the voids 15, and thus can be separated (removed) from the substrate 1. After the structure 4 has been removed from the substrate 1, the structure 4 is supported by a metal ring (frame) 5. At this time point, the structure can be applied to an electrically good glass ceramic substrate.

公开(公告)号：JPS6424084A

公开(公告)日：1989-01-26

申请号：JP12082888

申请日：1988-05-19

Applicant: IBM

Inventor： SUTEIBUN JIYOOJI BAABII ,  HANGUUCHIYANGU HAANGU ,  DONARUDO JIYON HANTO ,  JIYUNJIYARU KIMU ,  JIII MINGU PAAKU ,  CHIYAARUZU HANPUTON PERII ,  DAAYUUN SHIII

IPC: B32B18/00 ,  C03C17/22 ,  C03C17/23 ,  C03C17/245 ,  C04B41/50 ,  C04B41/87 ,  H01L23/15 ,  H05K1/03