公开(公告)号：JPH05211249A

公开(公告)日：1993-08-20

申请号：JP11070592

申请日：1992-04-03

Applicant: IBM

Inventor： GUNANARINGAMU AAJIYABARINGAMU ,  ARINA DOICHIE ,  FUADO ERIASU DOANII ,  BURUUSU KENESU FUAAMAN ,  DONARUDO JIYON HANTO ,  CHIYANDORASEKAA NARAYAN ,  MODESUTO MAIKERU OPURISUKO ,  SANPASU PURUSHIYOSAMAN ,  BINSENTO RANIERI ,  SUTEFUAN RENITSUKU ,  JIEEN MAAGARETSUTO SHIYOO ,  JIYANUSU SUTANISUROU UIRUKUJIN ,  DEBITSUTO FURANKU UITSUTOMAN

IPC: B23K26/00 ,  B32B37/00 ,  H01L21/68 ,  H01L23/12 ,  H01L23/15 ,  H05K3/00 ,  H05K3/46

Abstract: PURPOSE: To enable simultaneous manufacture of a multi-layered thin-film interconnection structure and a ceramic substrate with a good yield by forming on a transmitting substrate a separation layer which is less formed, when reacted with a predetermined electromagnetic radiation. CONSTITUTION: A polymer layer 2 is cut off by applying an ultraviolet light 10 from a scanning layer, via a transmitting substrate 1 to the polymer layer 2. Since a metallic layer 3 acts as a reflecting layer, the ultraviolet light 10 cannot reach an interconnection structure 4. As a result of the laser cut-off, monomer pieces, that is, an emitted substance gas is trapped between the substrate 1 and reflecting metal layer 3, thus forming voids 15 within the polymer layer 2. The polymer layer 2 is formed less due to the voids 15, and thus can be separated (removed) from the substrate 1. After the structure 4 has been removed from the substrate 1, the structure 4 is supported by a metal ring (frame) 5. At this time point, the structure can be applied to an electrically good glass ceramic substrate.

公开(公告)号：JPH06283622A

公开(公告)日：1994-10-07

申请号：JP33437693

申请日：1993-12-28

Applicant: IBM

Inventor： GIURIO DEIJIAKOMO ,  JIYUNGUUIIRU KIMU ,  CHIYANDORASEKUHAARU NARAYAN ,  SANPASU PURUSHIYOSAMAN

IPC: H01L23/12 ,  H01L21/28 ,  H01L23/485 ,  H01L23/498 ,  H01L23/532 ,  H01L29/43 ,  H05K1/09 ,  H05K3/24 ,  H05K3/34 ,  H05K3/38

Abstract: PURPOSE: To provide structure and a method for preventing metal diffusion between a noble metal layer and an adjacent non-noble metal layer, and new structure and a method for realizing super barrier structure, in particular, between copper and an adjacent noble metal layer. CONSTITUTION: A non-noble metal layer 16, a titanium layer 17, a molybdenum layer 18, and a noble metal layer 20 or a metal layer 20 whose noble metal property is relatively low are deposited in order as metals for mutual connection. This structure concerns also with an improved multilayered metal pad or metal structure to be connected with pins or connectors or a part of wiring of a substrate.

公开(公告)号：JPH06184601A

公开(公告)日：1994-07-05

申请号：JP11119393

申请日：1993-04-15

Applicant: IBM

Inventor： SANGU KUUON KANGU ,  SANPASU PURUSHIYOSAMAN ,  JIYON JIEIMUSU RITSUKO ,  JIEEN MAAGARETSUTO SHIYOU ,  SABUHASHIYU RAKUSUMAN SHINDO

IPC: B01F3/18 ,  B22F1/00 ,  B22F9/04 ,  C22C1/10 ,  H05K1/09

Abstract: PURPOSE: To provide a method of producing a powder of metal particles containing grain growth control additives. CONSTITUTION: A powder of metal particles, such as copper particles, is mixed with a powder of additive particles, such as alumina particles. The resultant mixture is subjected to high energy ball milling to obtain the metal particles where the additive particles are substantially uniformly dispersed. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder has particles of sufficiently small size to fill a via between metallization layers constituting the green ceramic precursor to a ceramic substrate. When a combination of ceramic precursor and conductor forming paste is sintered, the grain growth control additive results in a substantially void free via filled with metal having a fine grain morphology.