公开(公告)号：CA1139018A

公开(公告)日：1983-01-04

申请号：CA352389

申请日：1980-05-21

Applicant: IBM

Inventor： DOUGHERTY WILLIAM E JR

IPC: H01L21/3213 ,  H01L21/3205 ,  H01L21/48 ,  H01L21/768 ,  H01L23/525 ,  H05K3/22 ,  H05K3/46 ,  H01L21/30

Abstract: Repair of opens and shorts in semiconductor packages and chip metallurgy by initial conversion of shorts into opens by severing of lines about the shorts, followed by interconnection of conductor patch lines to the good circuit portions through an insulating layer.

公开(公告)号：FR2356447A1

公开(公告)日：1978-01-27

申请号：FR7714016

申请日：1977-05-03

Applicant: IBM

Inventor： DOUGHERTY WILLIAM E JR ,  GREGOR LAWRENCE V ,  KLEIN DONALD L ,  REDMOND THOMAS F ,  REEBER MORTON D

IPC: F25D9/00 ,  G12B15/02 ,  H01L23/427 ,  H05K7/20 ,  H01L23/44 ,  B01D43/00

Abstract: A device for removing contaminant impurities, particularly contaminants existing at very low levels, from a liquid, including a heating element at least partially immersible in the liquid, a confinement means at least partially immersible in the liquid for maintaining a pulsating bubble of vapor of the liquid, the heating element located within the confining means, openings in the confining means to allow periodic partial escape of the vapor bubble and ingress of liquid.