公开(公告)号：US3558374A

公开(公告)日：1971-01-26

申请号：US3558374D

申请日：1968-01-15

Applicant: IBM

Inventor： BOSS DAVID W ,  DOO VEN Y ,  PATTERSON WILLIAM N

IPC: C23C16/44 ,  C23C16/00 ,  C30B25/02 ,  C30B29/06 ,  C30B31/06 ,  H01L21/00 ,  H01L21/205 ,  H01L21/22 ,  H01L21/331 ,  H01L21/763 ,  H01L21/86 ,  H01L27/00 ,  H01L29/04 ,  H01L29/73 ,  H01L29/78 ,  H01L7/36

CPC classification number: H01L29/04 ,  C23C16/00 ,  H01L21/00 ,  H01L27/00 ,  Y10S148/085 ,  Y10S148/122 ,  Y10S148/15

Abstract: A FILM OF A POLYCRYSTALLINE MATERIAL IS DEPOSITED PYROLYTICALLY ON AN ELECTRICALLY INSULATING SURFACE OF A SUBSTRATE. BY CONTROLLING THE RATE OF DEPOSITION OF THE MATERIAL ON THE SUBSTRATE AND THE TEMPERATURE OF THE SUBSTRATE, THE GRAIN SIZE OF THE POLYCRYSTALLINE FILM IS REGULATED SO THAT PN JUNCTIONS HAVING A SHARP REVERSE BIASED BREAKDOWN MAY BE FORMED THEREIN.

公开(公告)号：CA960943A

公开(公告)日：1975-01-14

申请号：CA139469

申请日：1972-04-12

Applicant: IBM

Inventor： BOSS DAVID W ,  SPIRO ANDREA

IPC: H01L21/00 ,  H01L21/22

公开(公告)号：CA1286791C

公开(公告)日：1991-07-23

申请号：CA589395

申请日：1989-01-27

Applicant: IBM

Inventor： BOSS DAVID W ,  CARR TIMOTHY W ,  DUBETSKY DERRY J ,  GREENSTEIN GEORGE M ,  GROBMAN WARREN D ,  HAYUNGA CARL P ,  KUMAR ANANDA H ,  LANGE WALTER F ,  MASSEY ROBERT H ,  PALMATEER PAUL H ,  ROMANO JOHN A ,  SHIH DA-YUAN

IPC: H05K9/00 ,  H01L23/498 ,  H05K3/46 ,  H01L23/485

Abstract: Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymeric overlayers with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

公开(公告)号：DE3671580D1

公开(公告)日：1990-06-28

申请号：DE3671580

申请日：1986-06-18

Applicant: IBM

Inventor： BOSS DAVID W ,  DUBETSKY DERRY JAY

IPC: H01L23/538 ,  C04B35/64 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/46

Abstract: A method of fabricating a multilayer ceramic sub­strate with an internal conductive metallurgy circuit network, wherein additional green sheet material (36) is added to the stack (30) of ceramic green sheets during assembly to areas of the substrate outside of the con­ductive metallurgy to compensate for the volume of conductive metal paste and to thereby eliminate or minimize substrate distortion during the sintering operation.

公开(公告)号：CA1232978A

公开(公告)日：1988-02-16

申请号：CA501733

申请日：1986-02-12

Applicant: IBM

Inventor： BOSS DAVID W ,  DUBETSKY DERRY J

IPC: H01L23/538 ,  C04B35/64 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/46 ,  H01L27/04 ,  H01L21/72

Abstract: Process For Minimizing Distortion In Multilayer Ceramic Substrates A method of fabricating a multilayer ceramic substrate with an internal conductive metallurgy circuit network, wherein additional green sheet material is added to the stack of ceramic green sheets during assembly to areas of the substrate outside of the conductive metallurgy to compensate for the volume of conductive metal paste to thereby eliminate or minimize substrate distortion during the sintering operation. FI9-85-002

公开(公告)号：BR8603483A

公开(公告)日：1987-03-04

申请号：BR8603483

申请日：1986-07-24

Applicant: IBM

Inventor： BOSS DAVID W ,  DUBETSKY DERRY JAY

IPC: H01L23/538 ,  C04B35/64 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/46 ,  H05K7/20

Abstract: A method of fabricating a multilayer ceramic sub­strate with an internal conductive metallurgy circuit network, wherein additional green sheet material (36) is added to the stack (30) of ceramic green sheets during assembly to areas of the substrate outside of the con­ductive metallurgy to compensate for the volume of conductive metal paste and to thereby eliminate or minimize substrate distortion during the sintering operation.