2.
    发明专利
    未知

    公开(公告)号:DE3786851T2

    公开(公告)日:1994-03-17

    申请号:DE3786851

    申请日:1987-05-05

    Applicant: IBM

    Abstract: Laser induced fluorescence is utilized to detect the reactive ion etch-through of a given layer in a wafer by detecting a large change in the concentration of a wafer selected minor species from the wafer in the etching plasma. This selected minor species must be present in a significantly different concentration in the etched given layer compared to any of the other layers in the wafer in order to provide a proper endpoint detection. In one embodiment, when the large change in the selected minor species concentration is detected, then the RF electrodes for the reactor are de-energized.

    PERFORATED ANODE FOR USE IN REACTIVE ION ETCHING APPARATUS

    公开(公告)号:DE3274507D1

    公开(公告)日:1987-01-15

    申请号:DE3274507

    申请日:1982-04-27

    Applicant: IBM

    Abstract: Reactive Ion Etching (RIE) apparatus which provides for uniform etching of substrates (9) regardless of their position on a cathode (4) utilizes a perforated anode (10). These perforations (11) are interlaced, intersected or partially blocked with various configurations of conductive elements (12). Concentric circle, starburst, spiral arm and spiral configurations may be interlaced with the perforations in the anode to obtain uniform etching of substrates regardless of their radial position on the cathode. With all these configurations, the common factor is that the interlaced configurations intersect more perforations near the center of the anode or catcher plate than are intersected at greater radial distances.

    4.
    发明专利
    未知

    公开(公告)号:DE3786851D1

    公开(公告)日:1993-09-09

    申请号:DE3786851

    申请日:1987-05-05

    Applicant: IBM

    Abstract: Laser induced fluorescence is utilized to detect the reactive ion etch-through of a given layer in a wafer by detecting a large change in the concentration of a wafer selected minor species from the wafer in the etching plasma. This selected minor species must be present in a significantly different concentration in the etched given layer compared to any of the other layers in the wafer in order to provide a proper endpoint detection. In one embodiment, when the large change in the selected minor species concentration is detected, then the RF electrodes for the reactor are de-energized.

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