公开(公告)号：JP2010079896A

公开(公告)日：2010-04-08

申请号：JP2009209893

申请日：2009-09-11

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： XIANG HUA ,  ECONOMIKOS LAERTIS ,  FAYAZ MOHAMMED FAZIL ,  GRECO STEPHEN EDWARD ,  O'NEIL PATRICIA A ,  PURI RUCHIR

IPC: G06F17/50 ,  H01L21/82

CPC classification number: G06F17/5009 ,  G06F2217/12 ,  Y02P90/265

Abstract: PROBLEM TO BE SOLVED: To provide a method, apparatus and computer program for performing simulation of influence of a manufacturing process to electrical performance in the integrated circuit during design stage.
SOLUTION: Methods, apparatus and computer program provide a fast and accurate model for simulating the effects of chemical mechanical polishing (CMP) steps during fabrication of an integrated circuit by generating a design of an integrated circuit, using a simplified model while generating the design of the integrated circuit, predicting at least one physical characteristic of the integrated circuit which results from a processing step to be used during manufacture of the integrated circuit, wherein the simplified model is derived from simulations performed prior to the design generation activities using a comprehensive simulation program used to model the physical characteristic; predicting performance of the integrated circuit using the predicted physical characteristic; and adjusting the design of the integrated circuit in dependence on the performance prediction.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于在设计阶段期间对集成电路中的制造过程对电气性能的影响进行模拟的方法，装置和计算机程序。 解决方案：方法，设备和计算机程序提供了一种快速准确的模型，用于在集成电路制造过程中模拟化学机械抛光（CMP）步骤的效果，通过使用简化模型生成集成电路的设计，同时产生 集成电路的设计，预测由在集成电路的制造期间使用的处理步骤产生的集成电路的至少一个物理特性，其中简化模型是从使用 综合仿真程序用于建模物理特性; 使用预测的物理特性预测集成电路的性能; 并根据性能预测调整集成电路的设计。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：SG160271A1

公开(公告)日：2010-04-29

申请号：SG2009048448

申请日：2009-07-17

Applicant: IBM

Inventor： XIANG HUA ,  ECONOMIKOS LAERTIS ,  FAYAZ MOHAMMED FAZIL ,  PURI RUCHIR ,  GRECO STEPHEN EDWARD ,  O NEIL PATRICIA A

Abstract: Methods, apparatus and computer program products provide a fast and accurate model for simulating the effects of chemical mechanical polishing (CMP) steps during fabrication of an integrated circuit by generating a design of an integrated circuit; while generating the design of the integrated circuit, using a simplified model to predict at least one physical characteristic of the integrated circuit which results from a CMP processing step to be used during manufacture of the integrated circuit, wherein the simplified model is derived from simulations performed prior to the design generation activities using a comprehensive simulation program used to model the physical characteristic; predicting performance of the integrated circuit using the predicted physical characteristic; and adjusting the design of the integrated circuit in dependence on the performance prediction.