公开(公告)号：CA1257786A

公开(公告)日：1989-07-25

申请号：CA498313

申请日：1985-12-20

Applicant: IBM

Inventor： FOUTS DAVID P ,  GUPTA DEVANDRA ,  HO PAUL S ,  JASPAL JASVIR S ,  LLOYD JAMES R JR ,  OBERSCHMIDT JAMES M ,  SRIKRISHNAN KRIS V ,  SULLIVAN MICHAEL J

IPC: B23K1/00 ,  B23K35/26 ,  C22C1/00 ,  C22C11/06 ,  H01B1/02 ,  H01B13/00 ,  C22C30/04

Abstract: ELECTROMIGRATION LIFETIME INCREASE OF LEAD BASE ALLOYS Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.