公开(公告)号：JP2001118813A

公开(公告)日：2001-04-27

申请号：JP30089099

申请日：1999-10-22

Applicant: IBM

Inventor： BRASTA BRUSICK ,  EDELSTEIN DANIEL C ,  PAUL M FENII ,  WILLIAM GUTHRIE ,  MARK JASO ,  FRANK B KAUFFMANN ,  NAFUTARI RASUTEIGU ,  PETER LAUPER ,  RODBELL KENNETH ,  DAVID B THOMPSON

IPC: H01L21/304 ,  C09K3/14 ,  C09K13/00 ,  C09K13/02 ,  C09K13/04 ,  C09K13/06

Abstract: PROBLEM TO BE SOLVED: To speedily eliminate copper and to minimize the loss of copper in a patterned interconnected body without eliminating a metal layer and a dielectric layer at a lower side or corroding copper. SOLUTION: The chemical - mechanical polishing(CMP) slurry for polishing the layer of copper or that of the alloy of copper contains an etchant, an oxidation suppression agent, and an additive for adjusting the complexing between the copper and the oxidation suppression agent.