公开(公告)号：DE69302205T2

公开(公告)日：1996-10-10

申请号：DE69302205

申请日：1993-02-15

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  FRANKEL GERALD SIMON ,  PETERSEN TINA ALEXEANDRIA ,  RUSH BENJAMIN MARK ,  SCHROTT ALEJANDRO G

IPC: C23F11/00 ,  C23F11/10 ,  C23F11/14 ,  G11B5/187 ,  G11B5/31 ,  G11B5/72 ,  G11B5/84

Abstract: A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilutesolution of Cu ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu and 1 H-BTA results in a spontaneous interaction of Cu and the metal to produce a film layer of Cu(I)BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.

公开(公告)号：DE69206034D1

公开(公告)日：1995-12-21

申请号：DE69206034

申请日：1992-04-11

Applicant: IBM

Inventor： FRANKEL GERALD SIMON ,  KHANDROS IGOR Y ,  MADAKSON PETER BITRUS

IPC: C23C14/06 ,  C23C14/14 ,  C23C14/48 ,  C23C14/58 ,  G01N27/72 ,  G01R33/09 ,  G11B5/31 ,  G11B5/39 ,  H01F10/08 ,  H01F10/14 ,  H01F10/32 ,  H01F41/14 ,  H01F41/32 ,  H01L43/12 ,  C23C14/08

公开(公告)号：DE69206034T2

公开(公告)日：1996-06-20

申请号：DE69206034

申请日：1992-04-11

Applicant: IBM

Inventor： FRANKEL GERALD SIMON ,  KHANDROS IGOR Y ,  MADAKSON PETER BITRUS

IPC: C23C14/06 ,  C23C14/14 ,  C23C14/48 ,  C23C14/58 ,  G01N27/72 ,  G01R33/09 ,  G11B5/31 ,  G11B5/39 ,  H01F10/08 ,  H01F10/14 ,  H01F10/32 ,  H01F41/14 ,  H01F41/32 ,  H01L43/12 ,  C23C14/08

公开(公告)号：DE69302205D1

公开(公告)日：1996-05-23

申请号：DE69302205

申请日：1993-02-15

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  FRANKEL GERALD SIMON ,  PETERSEN TINA ALEXEANDRIA ,  RUSH BENJAMIN MARK ,  SCHROTT ALEJANDRO G

IPC: C23F11/00 ,  C23F11/10 ,  C23F11/14 ,  G11B5/187 ,  G11B5/31 ,  G11B5/72 ,  G11B5/84

Abstract: A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilutesolution of Cu ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu and 1 H-BTA results in a spontaneous interaction of Cu and the metal to produce a film layer of Cu(I)BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.