公开(公告)号：DE69113188D1

公开(公告)日：1995-10-26

申请号：DE69113188

申请日：1991-07-18

Applicant: IBM

Inventor： GALICKI ARKADI ,  HORNG CHENG TZONG ,  SCHWENKER ROBERT OTTO

IPC: C23C14/22 ,  C23C14/34 ,  H01J37/32 ,  C23C14/14 ,  H01J37/34

公开(公告)号：DE3069592D1

公开(公告)日：1984-12-13

申请号：DE3069592

申请日：1980-07-01

Applicant: IBM

Inventor： GALICKI ARKADI ,  HAYUNGA CARL PETER ,  SARKARY HOMI GUSTADJI

IPC: C23C14/22 ,  C23C14/34 ,  C23C15/00

Abstract: A sputtering system adapted for depositing quartz in uniform thicknesses upon multiple wafers processed in batches including an anode plate having a plurality of wafer locations spaced from the center of the anode, with each wafer location comprising a wafer receiving recess in the anode plate having an angular bottom slope which, in effect, tilts the wafer to an optimum deposition angle with respect to the cathode, depending upon wafer spacing from the center of the anode, to insure uniform deposition across the wafer.