公开(公告)号：JP2001291425A

公开(公告)日：2001-10-19

申请号：JP2001044645

申请日：2001-02-21

Applicant: IBM

Inventor： GELORME JEFFREY D ,  GANG SUN K ,  PAPATHOMAS KONSTANTINOS ,  PURUSHOTHAMAN SAMPATH

IPC: C09J9/02 ,  C09J163/00 ,  C09J171/10 ,  C09J191/00 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01B13/00 ,  H01B17/64

Abstract: PROBLEM TO BE SOLVED: To provide a conductive adhesive having a wide property selective range by using micrometer size range particles of random size coated with a low-melting-point metal. SOLUTION: The coated particles are suspended in a vehicle consisting of a mixture of a thermosetting resin and a fusing agent resin selected for electrical and mechanical property in terms of viscosity, low contraction, screen printing ability and wide range specifications. The vehicle or resin system includes thermosetting alicyclic epoxy, thermosetting phenoxy polymer and thermosetting single-functional limonene oxide. A low-melting-point coating system for the particles contains In, Sn and In-Sn, Sn-Pb, Bi-Sn-In or InAg alloy. The micrometer size range particles contain Cu, Ni, Co, Ag, Pd, Pt, a polymer and a ceramic.