公开(公告)号：JP2001267356A

公开(公告)日：2001-09-28

申请号：JP2001032285

申请日：2001-02-08

Applicant: IBM

Inventor： CARLOS J SAMUBUSETTEI ,  EDELSTEIN DANIEL C ,  JOHN G GAUDEIERO ,  JUDETH M RUBINO ,  GEORGE WALKER

IPC: H05K3/34 ,  C23C18/16 ,  H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H01L23/532 ,  H05K3/24 ,  H05K13/06

Abstract: PROBLEM TO BE SOLVED: TO provide a method for preparing an electrically connected copper pad having superior diffusing barrier characteristics and bonding characteristic. SOLUTION: The method for preparing an electrically connecting conductive pad comprises the steps of first preparing a copper pad surface 14 cleaned by an acid solution, than adhering a protective layer of a phosphorus or a boron-containing metal alloy to the surface of the pad, and then adhering an adhesive layer 18 of a noble metal onto the protective layer. In this case, a suitable thickness of the protective layer is in the range of 1,000 to about 10,000 Åor preferably about 3,000 to about 7,000 Å. The adhesive layer is formed of the noble metal, such as Au, Pt, Pd, Ag or the like and can be formed into a thickness of about 500 to about 4,000 Å or preferably about 1,000 to about 2,000 Å. Or before electrolessly adhering of the protective layer, a Pd nucleating layer may be adhered between the surface of the copper conductive pad and the protective layer.

公开(公告)号：SG90233A1

公开(公告)日：2002-07-23

申请号：SG200100784

申请日：2001-02-13

Applicant: IBM

Inventor： CARLOS J SAMBUCETTI ,  DANIEL CHARLES EDELSTEIN ,  JOHN G GAUDIELLO ,  JUDITH M RUBINO ,  GEORGE WALKER

IPC: H05K3/34 ,  C23C18/16 ,  H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H01L23/532 ,  H05K3/24 ,  H05K13/06 ,  H01L23/522

Abstract: A method for preparing a copper pad surface for electrical connection that has superior diffusion barrier and adhesion properties is provided. In the method, a copper pad surface is first provided that has been cleaned by an acid solution, a protection layer of a phosphorus or boron-containing metal alloy is then deposited on the copper pad surface, and then an adhesion layer of a noble metal is deposited on top of the protection layer. The protection layer may be a single layer, or two or more layers intimately joined together formed of a phosphorus or boron-containing metal alloy such as Ni-P, Co-P, Co-W-P, Co-Sn-P, Ni-W-P, Co-B, Ni-B, Co-Sn-B, Co-W-B and Ni-W-B to a thickness between about 1,000 Å and about 10,000 Å. The adhesion layer can be formed of a noble metal such as Au, Pt, Pd and Ag to a thickness between about 500 Å and about 4,000 Å.