公开(公告)号：JPH10303059A

公开(公告)日：1998-11-13

申请号：JP10894598

申请日：1998-04-20

Applicant: IBM

Inventor： DALAL HORMAZDYAR M ,  GAUDENZI GENE JOSEPH ,  GORRELL REBECCA Y ,  TAKACS MARK A ,  TRAVIS JR KENNETH J

IPC: H01G4/228 ,  H01L25/00

Abstract: PROBLEM TO BE SOLVED: To provide a superior direct capacitor attachment by loading a mask so that the opening of the mask exposes the upper face of a high melting point solder ball, making low melting point metallic layer adhere on the high melting point solder ball and forming a capacitor having a low melting point metallic cap. SOLUTION: The high melting point solder ball (solder ball) 18 is formed on the semiconductor moist pad 16 of the multilayer insulating capacitor 10. The solder moist pad 16 is connected to the inner electrodes 11 of the capacitor 10 through a shorting bar 12. The mask 20 having the opening 26 is loaded on the capacitor 10 having a solder ball assembly 14 and the solder ball 18. The uppermost part of the solder ball 18 is exposed and tin 23 is adhered by a solder evaporator. When the solder ball 18 having a tin cap 23 is reflowed, an eutectic alloy 43 is formed on the uppermost part of the solder ball 18 and it can be joined to the circuit 47 of a substrate constituted of copper foil on an organic carrier card 40.