公开(公告)号：JP2002151170A

公开(公告)日：2002-05-24

申请号：JP2001210998

申请日：2001-07-11

Applicant: IBM

Inventor： GRAHAM TERESITA O ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: C08K9/02 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide conductive paste material safe for the environment and manufacturable at a low cost. SOLUTION: The paste material is made from a polymeride material and particles of Cu, etc., having conductive coatings, for example Sn coating. Coupling is established by melting the coatings of adjoining particles with heat. The polymeride material should be of thermoplastic type and is applied to two surfaces having electric conductivity, for example between a chip and the pad of a substrate so that electric connection and adhesion between the pads are established.

公开(公告)号：CA2159234A1

公开(公告)日：1996-04-21

申请号：CA2159234

申请日：1995-09-27

Applicant: IBM

Inventor： GRAHAM TERESITA O ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH M ,  SARAF RAVI F

IPC: C08K9/02 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32 ,  B23K35/26 ,  H01B5/00 ,  B23K1/00

Abstract: A structure and method of fabrication are described. The structure is a combination of a polymeric material and particles, e.g. Cu, having an electrically conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic. The structure is disposed between two electrically conductive surfaces, e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.

公开(公告)号：MY118121A

公开(公告)日：2004-09-30

申请号：MYPI9502913

申请日：1995-09-29

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: C08K9/02 ,  H05K3/32 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18

Abstract: A STRUCTURE AND METHOD OF FABRICATION ARE DESCRIBED. THE STRUCTURE (30) IS A COMBINATION OF A POLYMERIC MATERIAL (36) AND PARTICLES (32), E.G. CU, HAYING AN ELECTRICALLY CONDUCTIYE COATING (34), E.G. SN. HEAT IS APPLIED TO FUSE THE COATING OF ADJACENT PARTICLES. THE POLYMERIC MATERIAL IS A THERMOPLASTIC. THE STRUCTURE IS DISPOSED BETWEEN TWO ELECTRICALLY CONDUCTIYE SURFACES (40, 42), E.G. CHIP AND SUBSTRATE PADS, TO PROYIDE ELECTRICAL INTERCONNECTION AND ADHESION BETWEEN THEIR PADS. (FIGURE 3)

公开(公告)号：SG33468A1

公开(公告)日：1996-10-18

申请号：SG1995001167

申请日：1995-08-21

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: H01R4/02 ,  H05K3/34 ,  H05K3/42

公开(公告)号：SG121693A1

公开(公告)日：2006-05-26

申请号：SG200104767

申请日：1997-11-10

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  DIMITRAKOPOULOS CHRISTOS DIMIT ,  FURMAN BRUCE KENNETH ,  GRAHAM TERESITA O

IPC: H01L21/3205 ,  G02F1/1343 ,  G02F1/1345 ,  H01L21/28 ,  H01L21/288 ,  H01L21/58 ,  H01L23/52 ,  H01L27/148 ,  H01L29/43 ,  H01L29/45 ,  H01L29/49 ,  H01L29/786 ,  H01L31/00 ,  H01L31/10 ,  H01L33/38 ,  H01L33/40 ,  H01L33/42 ,  H01L51/05 ,  H01L51/40 ,  H01L51/50 ,  H01L51/52 ,  H05B33/12 ,  H05B33/14 ,  H05B33/26

公开(公告)号：SG77619A1

公开(公告)日：2001-01-16

申请号：SG1997004678

申请日：1995-08-21

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: C08K9/02 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32

Abstract: A structure and method of fabrication are described. The structure is a combination of a polymeric material (36) and particles (32), e.g. Cu, having an electrically conductive coating (34), e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material (36) is a thermoplastic. The structure is disposed between two electrically conductive surfaces (40,42), e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.