公开(公告)号：US6433115B2

公开(公告)日：2002-08-13

申请号：US81911901

申请日：2001-03-27

Applicant: IBM

Inventor： HAWKER CRAIG JON ,  KLAERNER GERRIT ,  LEE JEONG-IK ,  LEE VICTOR YEE-WAY ,  MILLER ROBERT DENNIS ,  SCOTT JOHN CAMPBELL

IPC: C08G61/02 ,  C08G61/12 ,  C08G73/02 ,  C08G73/06 ,  C08G73/08 ,  C09K11/06 ,  H01L51/00 ,  H01L51/30 ,  H01L51/50 ,  C08F112/06

CPC classification number: C09K11/06 ,  C08G61/02 ,  C08G61/12 ,  C08G73/02 ,  C08G73/06 ,  C08G73/0627 ,  C08G73/0633 ,  C08G73/0688 ,  C08G73/0694 ,  C08G73/08 ,  H01L51/0039 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/0052 ,  H01L51/5012

Abstract: Multifunctional electroactive copolymers are provided. The copolymers may be A-B-A triblock copolymers, brush-type graft copolymers, or variations thereof. In a preferred embodiment, the copolymers are "dual use" in that they comprise both a light emitting segment and a charge transport segment. Methods of synthesizing the novel electroactive copolymers are provided as well, as are opto-electronic devices, particularly LEDs, fabricated with the novel copolymers.

Abstract translation: 提供多功能电活性共聚物。 共聚物可以是A-B-A三嵌段共聚物，刷型接枝共聚物或其变体。 在优选的实施方案中，共聚物是“双重用途”，因为它们包括发光区段和电荷传输区段。 还提供了合成新的电活性共聚物的方法，以及用新型共聚物制造的光电子器件，特别是LED。

公开(公告)号：MY115696A

公开(公告)日：2003-08-30

申请号：MYPI9704488

申请日：1997-09-26

Applicant: IBM

Inventor： HAWKER CRAIG JON ,  HEDRICK JAMES LUPTON ,  MILLER ROBERT DENNIS

IPC: H01L21/28 ,  H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: THE INVENTION RELATES TO AN INTEGRATED CIRCUIT DEVICE COMPRISING (I) A SUBSTRATE; (II) METALLIC CIRCUIT LINES POSITIONED ON THE SUBSTRATE AND (III) A DIELECTRIC MATERIAL POSITIONED ON THE CIRCUIT LINES. THE DIELECTRIC MATERIAL COMPRISES THE REACTION PRODUCT OF A HYPERBRANCHED POLYMER AND ORGANIC POLYSILICA. (FIG.1)

公开(公告)号：SG73471A1

公开(公告)日：2000-06-20

申请号：SG1997003521

申请日：1997-09-24

Applicant: IBM

Inventor： HAWKER CRAIG JON ,  HEDRICK JAMES LUPTON ,  MILLER ROBERT DENNIS

IPC: H01L21/312 ,  H01L21/768 ,  H01L21/3205 ,  H01L23/522 ,  H01L23/532 ,  H05K1/05

Abstract: The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of a hyperbranched polymer and organic polysilica.