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1.发明授权公开(公告)号：US6433115B2
公开(公告)日：2002-08-13
申请号：US81911901
申请日：2001-03-27
Applicant: IBM
Inventor： HAWKER CRAIG JON , KLAERNER GERRIT , LEE JEONG-IK , LEE VICTOR YEE-WAY , MILLER ROBERT DENNIS , SCOTT JOHN CAMPBELL
IPC: C08G61/02 , C08G61/12 , C08G73/02 , C08G73/06 , C08G73/08 , C09K11/06 , H01L51/00 , H01L51/30 , H01L51/50 , C08F112/06
CPC classification number: C09K11/06 , C08G61/02 , C08G61/12 , C08G73/02 , C08G73/06 , C08G73/0627 , C08G73/0633 , C08G73/0688 , C08G73/0694 , C08G73/08 , H01L51/0039 , H01L51/004 , H01L51/0043 , H01L51/0052 , H01L51/5012
Abstract: Multifunctional electroactive copolymers are provided. The copolymers may be A-B-A triblock copolymers, brush-type graft copolymers, or variations thereof. In a preferred embodiment, the copolymers are "dual use" in that they comprise both a light emitting segment and a charge transport segment. Methods of synthesizing the novel electroactive copolymers are provided as well, as are opto-electronic devices, particularly LEDs, fabricated with the novel copolymers.
Abstract translation: 提供多功能电活性共聚物。 共聚物可以是A-B-A三嵌段共聚物，刷型接枝共聚物或其变体。 在优选的实施方案中，共聚物是“双重用途”，因为它们包括发光区段和电荷传输区段。 还提供了合成新的电活性共聚物的方法，以及用新型共聚物制造的光电子器件，特别是LED。
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2.发明申请LOW-K INTERLEVEL DIELECTRIC MATERIALS AND METHOD OF FORMING LOW-K INTERLEVEL DIELECTRIC LAYERS AND STRUCTURES 审中-公开低K层间介电材料和形成低K层间介电层和结构的方法
公开(公告)号：WO2007014882A2
公开(公告)日：2007-02-08
申请号：PCT/EP2006064640
申请日：2006-07-25
Applicant: IBM , IBM UK , HEDRICK JAMES LUPTON , MAGBITANG TEDDIE PEREGRINO , SANKARAPANDIAN MUTHUMANICKAM , VOLKSEN WILLI , KIM HO-CHEOL , LEE VICTOR YEE-WAY , MILLER ROBERT DENNIS , SUNDBERG LINDA KARIN , DUBOIS GERAUD JEAN-MICHEL
Inventor： HEDRICK JAMES LUPTON , MAGBITANG TEDDIE PEREGRINO , SANKARAPANDIAN MUTHUMANICKAM , VOLKSEN WILLI , KIM HO-CHEOL , LEE VICTOR YEE-WAY , MILLER ROBERT DENNIS , SUNDBERG LINDA KARIN , DUBOIS GERAUD JEAN-MICHEL
CPC classification number: C08L101/12 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , H01L21/76807 , H01L21/7682 , H01L2221/1047
Abstract: A composition of matter and a structure fabricated using the composition. The composition comprising; a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.
Abstract translation: 使用该组合物制造的物质组成和结构。 该组合物包含： 树脂; 分散在树脂中的聚合物纳米颗粒，每种聚合物纳米颗粒包含多臂芯聚合物和连接到多臂芯聚合物上的侧链聚合物，与树脂不混溶的多臂芯聚合物和可混溶的侧链聚合物 与树脂; 和溶剂，所述溶剂在第一温度下是挥发性的，所述树脂在第二温度下可交联，所述聚合物纳米颗粒可在第三温度下分解，所述第三温度高于所述第二温度，所述第二温度高于所述第一温度 其中在将所述层从所述第二温度加热到所述第三温度之间，所述组合物层的厚度收缩小于约3.5％。
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公开(公告)号：WO2007096359A3
公开(公告)日：2008-01-10
申请号：PCT/EP2007051622
申请日：2007-02-20
Applicant: IBM , IBM UK , HEDRICK JAMES LUPTON , FROMMER JANE ELIZABETH , WINDELN JOHANNES , DUERIG URS , LEE VICTOR YEE-WAY , GOTSMANN BERND , MILLER ROBERT DENNIS , HAGBERG ERIK , MAGBITANG TEDDIE , KNOLL ARMIN , PRATT RUSSELL CLAYTON , WADE CHARLES
Inventor： HEDRICK JAMES LUPTON , FROMMER JANE ELIZABETH , WINDELN JOHANNES , DUERIG URS , LEE VICTOR YEE-WAY , GOTSMANN BERND , MILLER ROBERT DENNIS , HAGBERG ERIK , MAGBITANG TEDDIE , KNOLL ARMIN , PRATT RUSSELL CLAYTON , WADE CHARLES
CPC classification number: G11B9/149 , B82Y10/00 , C08G73/101 , C08G73/1046 , C08G73/105 , C08G73/1053 , C08G73/1064 , G11B9/1409 , G11B9/1454 , G11B11/007 , G11B2005/0021 , Y10T428/265 , Y10T428/31721
Abstract: An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.
Abstract translation: 提出了一种用于设计用于纳米级热机械存储装置的聚合物层的方法。 交联聚酰亚胺低聚物用作原子力数据存储装置中的记录层，与先前报道的交联和线性聚合物相比，显着提高了性能。 可以调整聚酰亚胺低聚物的交联以匹配读写擦除周期中所需的热和强度参数。 另外，交联聚酰亚胺低聚物适用于纳米级成像。
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公开(公告)号：JP2009120843A
公开(公告)日：2009-06-04
申请号：JP2008329614
申请日：2008-12-25
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： CRAIG JOHN HOKER , JAMES LUPTON HEDRICK , LEE VICTOR YEE-WAY , ROBERT DENNIS MILLER
IPC: C08J3/12 , C08J9/26 , C08J3/24 , C08J3/28 , C08J9/04 , H01L21/312 , H01L21/316 , H01L21/3205 , H01L21/768 , H01L23/14 , H01L23/522
CPC classification number: H01L21/316 , C08J3/24 , H01L21/312
Abstract: PROBLEM TO BE SOLVED: To provide a porous dielectric material used in electronic devices such as integrated circuits. SOLUTION: Crosslinked particles are manufactured by activating crosslinkable groups in synthetic polymer molecules. The crosslinkable groups are inert until activated and, when activated, undergo an irreversible intramolecular crosslinking reaction to form crosslinked particles. Further, the crosslinked particles are intermolecularly deactivated to the polymer molecules under the crosslinking condition. The crosslinked particles are also intermolecularly deactivated each other under the crosslinking condition. The resultant crosslinked particles having the decomposition temperature lower than that of the host-matrix material is mixed with the host-matrix material, heated up to the decomposition temperature of the crosslinked particle to irreversibly decompose the particles into the porous dielectric material. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供用于诸如集成电路的电子设备中的多孔电介质材料。 解决方案：通过在合成聚合物分子中活化可交联基团来制备交联颗粒。 可交联基团是惰性的，直到活化，并且当被活化时，经历不可逆的分子内交联反应以形成交联颗粒。 此外，交联颗粒在交联条件下与聚合物分子分子失活。 交联颗粒在交联条件下也分子内失活。 将得到的分解温度低于主体 - 基体材料的交联颗粒与主体 - 基体材料混合，加热到交联颗粒的分解温度，以将颗粒不可逆地分解成多孔电介质材料。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2000150785A
公开(公告)日：2000-05-30
申请号：JP31468798
申请日：1998-11-05
Applicant: IBM
Inventor： KENNETH RAYMOND CARTER , ROBERT FRANCIS COOK , MARTHA ERIN HERBISON , CRAIG JOHN HAWKER , JAMES LUPTON HEDRICK , LEE VICTOR YEE-WAY , ERIK GERHARD RINIGER , ROBERT DENNIS MILLER , BILLY VOLKSEN , DOU IEN YOON
IPC: H01L27/04 , C09K3/16 , H01L21/31 , H01L21/312 , H01L21/822
Abstract: PROBLEM TO BE SOLVED: To improve mechanical toughness and polishing characteristics by allowing a dielectric composition for creating an integrated circuit to contain a methylsilsesquioxan and a photosensitive base or a heat-sensitive base product. SOLUTION: In a multilayer integrated circuit device, the lower layer of insulated flattening metal circuit lines 4 is allowed to function as a substrate 2, a perpendicular metal stud 8 is formed in the substrate 2, and at the same time a dielectric material 6 is buried between the flattening metal circuit lines 4 for formation. The dielectric material 6 contains tetraalkoxysilane and tetraethoxy silane, alkyl/trialkoxy, or trihalo silicate, or dialkyl/dialkoxy, or alkyl (methyl) phenylsilsesquioxan that is mixed with dihalo silicate, and a photosensitive base or a heat-sensitive base product.
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Patent Agency Ranking
公开(公告)号：JP2005330495A
公开(公告)日：2005-12-02
申请号：JP2005215082
申请日：2005-07-25
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： CRAIG JOHN HOKER , JAMES LUPTON HEDRICK , LEE VICTOR YEE-WAY , ROBERT DENNIS MILLER
IPC: C08J3/12 , C08J3/24 , C08J3/28 , C08J9/04 , H01L21/312 , H01L21/316 , H01L21/768 , H01L23/522
CPC classification number: H01L21/316 , C08J3/24 , H01L21/312
Abstract: PROBLEM TO BE SOLVED: To provide a porous dielectric material applicable to electronic devices such as integrated circuits. SOLUTION: Crosslinked particles are produced by activating the crosslinkable groups on synthetic polymer. The crosslinkable groups are inert until activated and, when activated, undergo an irreversible intramolecular crosslinking reaction to form crosslinked particles. And the crosslinked particles are inert to the polymer molecules in intermolecular crosslinking under crosslinking conditions, and are inert to each other in intermolecular crosslinking under crosslinking conditions. The thus obtained crosslinked particles having a lower decomposition temperature than that of the host matrix material are mixed with the host matrix material, and the compound is heated to the decomposition temperature of the crosslinked particles to decompose the crosslinked particles so as to produce the porous dielectric material. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供可应用于诸如集成电路的电子器件的多孔电介质材料。 解决方案：通过活化合成聚合物上的可交联基团来制备交联颗粒。 可交联基团是惰性的，直到活化，并且当被活化时，经历不可逆的分子内交联反应以形成交联颗粒。 并且交联颗粒在交联条件下在分子间交联中对聚合物分子是惰性的，并且在交联条件下在分子间交联中彼此是惰性的。 将如此获得的具有比主体基质材料低的分解温度的交联颗粒与主体基质材料混合，并将化合物加热至交联颗粒的分解温度以分解交联颗粒，从而产生多孔介电 材料。 版权所有（C）2006，JPO＆NCIPI
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7.发明专利Manufacture of crosslinked particle from polymer having crosslinkable group capable of being activated 有权具有活化能力的可交联组合聚合物的交联颗粒的制备
公开(公告)号：JP2003313305A
公开(公告)日：2003-11-06
申请号：JP2003052870
申请日：2003-02-28
Inventor： CRAIG JOHN HOKER , JAMES LUPTON HEDRICK , LEE VICTOR YEE-WAY , ROBERT DENNIS MILLER
IPC: C08J3/12 , C08J3/24 , C08J3/28 , C08J9/04 , H01L21/312 , H01L21/316 , H01L21/768 , H01L23/522
CPC classification number: H01L21/316 , C08J3/24 , H01L21/312
Abstract: PROBLEM TO BE SOLVED: To obtain a crosslinked particle useful for manufacturing a dielectric material used for an electronic device such as an integrated circuit. SOLUTION: The crosslinked particle is manufactured by activating a crosslinkable group in a synthetic polymer. The crosslinkable group remains inactive until it is activated and, when activated, an intramolecular crosslinking reaction occurs irreversibly and the crosslinked particle is formed. In terms of intermolecular crosslinking, the crosslinked particle is kept inactive with each other and against the polymer molecule under the crosslinking condition. COPYRIGHT: (C)2004,JPO
Abstract translation: 要解决的问题：获得用于制造用于诸如集成电路的电子器件的电介质材料的交联颗粒。 解决方案：通过活化合成聚合物中的可交联基团制备交联颗粒。 可交联基团保持无活性，直到其被活化，并且当被激活时，分子内交联反应不可逆地发生并且形成交联颗粒。 在分子间交联方面，交联颗粒在交联条件下彼此保持无活性并相对于聚合物分子。 版权所有（C）2004，JPO
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公开(公告)号：DE112012001286B4
公开(公告)日：2017-05-18
申请号：DE112012001286
申请日：2012-03-19
Applicant: IBM , SAN JOSE STATE UNIV RES FOUND
Inventor： MILLER ROBERT DENNIS , SLY JOSEPH , NUNO HECTOR HUGO , TIJO MELIA , LEE VICTOR YEE-WAY
Abstract: Es ist eine Nanoschale offenbart, die einen Sternpolymer-Okklusionskomplex, der i) ein amphiphiles, monomolekulares Sternpolymer mit einem quervernetzten Kern, der mit 6 oder mehr eigenständigen Polymerarmen kovalent verbunden ist, und ii) ein Cargo-Material aufweist, das in dem Sternpolymer okkludiert ist; sowie eine Schale aufweist, die ein anorganisches Material in Kontakt mit einer peripheren Oberfläche des Sternpolymer-Okklusionskomplexes aufweist.
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公开(公告)号：ES2044083T3
公开(公告)日：1994-01-01
申请号：ES89301526
申请日：1989-02-16
Applicant: IBM
Inventor： ENGLER EDWARD MARTIN , LEE VICTOR YEE-WAY , NAZZAL ADEL ISSA , PARKIN STUART STEPHEN PAPWORTH
Abstract: Stable, bulk electrical superconductors are prepared by heating mixed metal oxides in the presence of oxygen in a closed vessel in a preheated oven for 1-5 hours at 850-900 DEG C. The final oxides are in the molar ratio Tl0.6-1.1Ca2-3Ba0.75-1.25Cu2-3O(5+ delta )-(9+ delta ), where delta is less than one.
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公开(公告)号：DE3881118T2
公开(公告)日：1993-12-02
申请号：DE3881118
申请日：1988-06-28
Applicant: IBM
Inventor： BROWN CHARLES ALLAN , ENGLER EDWARD MARTIN , LEE VICTOR YEE-WAY
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