公开(公告)号：JPH11111763A

公开(公告)日：1999-04-23

申请号：JP22770998

申请日：1998-08-12

Applicant: IBM

Inventor： PETER J BROFMAN ,  PATRICK A KOIKO ,  MARK G COURTNEY ,  JERZY FALUKE ,  LEWIS S GOLDMAN ,  RAYMOND A JACKSON ,  DAVID C LINNELL ,  GREGORY B MARTIN ,  FRANK L PONPEO ,  KATHLEEN A SUTATSURAA ,  HILTON T TOY

IPC: H01L21/60 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To form an extended solder bond between two electronic substrates which are mutually connected by the solder to form an electronic module, by heating the two substrates, imparting controlled separating force to the solder bond plasticized by the heat between the substrates, extending the solder bond, and refrigerating the resultant module to set the extended solder bond. SOLUTION: Solder bonds 12 having a height S are generally used for treating a printed circuit board or the like, i.e., a substrate 11, which is connected to a chip, i.e., a substrate 13. Specifically, the solder bonds 12 are formed between these two electronic substrates 11, 13 to form a mutually connected electronic module. Thereafter, the module is heated to plasticize the solder bonds 12. Subsequently, separating power is imparted to the two electronic substrates 11, 13 so as to extend the plasticized solder bonds 12, thereby forming an extended solder bond. Then, the module thus extended is refrigerated to complete the electronic module comprising the extended solder bond.

公开(公告)号：JPH11111764A

公开(公告)日：1999-04-23

申请号：JP22771398

申请日：1998-08-12

Applicant: IBM

Inventor： PETER J BROFMAN ,  PATRICK A KOIKO ,  MARK G COURTNEY ,  JAMES H KOVEL II ,  JERZY FALUKE ,  LEWIS S GOLDMAN ,  RAYMOND A JACKSON ,  DAVID C LINNELL ,  GREGORY B MARTIN ,  FRANK L PONPEO ,  KATHLEEN A SUTATSURAA ,  HILTON T TOY

IPC: B23K35/02 ,  H01L21/60 ,  H01L23/48 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To form an extended solder bond between two substrates which are mutually connected by solder to form an electronic module, by reflowing an extensible paste solder bump to extend an extension means thereof so as to raise the height of a first mutual solder connection, and forming an extended solder bond in the electronic module. SOLUTION: The distance between the upper surface of a substrate 19 and the lower surface of a substrate 16 which faces the substrate 19, is represented by C. A paste 17, which is formed on the substrate 19, is in receipt of the lower end of a reflowed solder ball 18 so as to be in contact therewith. The height of an extensible solder bump 14 is represented by B which is smaller than the height C of the solder ball 18. When the solder ball 18 is heated at a temperature high enough only to reflow itself, the substrate 16 lowers toward the substrate 19 as the solder ball 18 melts. Since the reflow temperature of the solder ball 18 is lower than that of the extensible solder bump 14, the bump 14 remains solid during the heating so as to contribute to preventing the substrate 16 from going down to the level lower than the height B.

公开(公告)号：JPH10308465A

公开(公告)日：1998-11-17

申请号：JP10919398

申请日：1998-04-20

Applicant: IBM

Inventor： JAMES HOWARD COVELL II ,  LANIE R BOLDE ,  DAVID LYN EDWARDS ,  LUIS SIGMUND GOLDMAN ,  GRUBER PETER A ,  HILTON T TOY

IPC: H01L23/02 ,  H01L23/10

Abstract: PROBLEM TO BE SOLVED: To enable a semiconductor substrate to be hermetically sealed up in a cap whose thermal expansion coefficient is different from that of the substrate by a method wherein a first thin solder interconnection layer is restrained from reflowing on a high-melting thick solder wall so as to enable a solder seal band to retain its layered structure. SOLUTION: A solder seal 23 is joined to a substrate 10 with a thin solder interconnection layer 41 formed on the substrate 10 and a thick solder wall 43 cast on a cap 20. The thick solder wall 43 is set different in chemical composition from the thin solder interconnection layer 41 so as to have a higher melting point than the thin solder interconnection layer 41. By this setup, the interconnection layer 41 can be reflowed so as to mount the cap 20 on the substrate 10 without melting or deflecting the thick wall 43. Therefore, a solder seal of this constitution is capable of coping with a case that a gap between a cap and a substrate is a few times as large as usual.

公开(公告)号：JP2009278089A

公开(公告)日：2009-11-26

申请号：JP2009113560

申请日：2009-05-08

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： COLGAN EVAN GEORGE ,  MAGERLEN JOHN HAROLD ,  SCHMIDT ROGER R ,  GAYNES MICHAEL ANTHONY ,  MARSTON KENNETH CHARLES ,  HILTON T TOY

IPC: H01L23/473 ,  H01L25/04 ,  H01L25/18

CPC classification number: H01L23/473 ,  F28F3/086 ,  F28F3/12 ,  F28F2260/02 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a multi-chip module having a liquid-cooling module which provides a thermal conductive path having a different thermal resistance for each chip, and minimizes a stress at a thermally conductive adhesive portion by heat in order to dissipate effectively heat from the plurality of chips having cooling requirements different from each other, and to provide a method for manufacturing the same. SOLUTION: An electronic apparatus is thermally conductively connected to a first chip 12 and a second chip 13, and includes a cooling liquid inlet, a cooling liquid outlet, and a cooling module 20 having a cooling liquid flow path extending from the cooling liquid inlet to the cooling liquid outlet. The first chip is thermally conductively connected to a first portion to be cooled by a cooling liquid flowing in the cooling liquid flow path in the cooling module, and the second chip is thermally conductively connected to a second portion to be cooled by the cooling liquid being warmed as a result of cooling the first chip and flowing in the cooling liquid flow path in the cooling module. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有液体冷却模块的多芯片模块，其为每个芯片提供具有不同热阻的导热路径，并且通过热量按顺序将热导电粘合剂部分处的应力最小化 有效地散热来自具有彼此不同的冷却要求的多个芯片的热量，并提供其制造方法。 解决方案：电子设备与第一芯片12和第二芯片13导热连接，并包括冷却液入口，冷却液出口和冷却模块20，冷却模块20具有从冷却 冷却液出口的液体入口。 第一芯片与通过在冷却模块中的冷却液流路中流动的冷却液冷却的第一部分导热连接，第二芯片与第二部分导热连接，第二部分被冷却液冷却 由于冷却第一芯片并在冷却模块中的冷却液流动路径中流动而加热。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JPH11111776A

公开(公告)日：1999-04-23

申请号：JP22747398

申请日：1998-08-12

Applicant: IBM

Inventor： PETER J BROFMAN ,  PATRICK A KOIKO ,  MARK G COURTNEY ,  JERZY FALUKE ,  LEWIS S GOLDMAN ,  RAYMOND A JACKSON ,  DAVID C LINNELL ,  GREGORY B MARTIN ,  FRANK L PONPEO ,  KATHLEEN A SUTATSURAA ,  HILTON T TOY

IPC: H01L23/12 ,  B23K3/06 ,  H01L21/60 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a device for extending mutual connection and junction between two substrates in an electronic circuit module. SOLUTION: A device applies separating (extending) force to two substrates 16 and 28 through the use of an expandable metal 20. A lift rod 25 mounted on a clamp bridge is moved upward by the expansion of the expandable metal to lift the fixed first substrate 16. A lift bridge 17 coupled to the clamp bridge is moved downward and is kept, in contact with the second substrate 28 connected to the first substrate.