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公开(公告)号：JPH11111763A
公开(公告)日：1999-04-23
申请号：JP22770998
申请日：1998-08-12
Applicant: IBM
Inventor： PETER J BROFMAN , PATRICK A KOIKO , MARK G COURTNEY , JERZY FALUKE , LEWIS S GOLDMAN , RAYMOND A JACKSON , DAVID C LINNELL , GREGORY B MARTIN , FRANK L PONPEO , KATHLEEN A SUTATSURAA , HILTON T TOY
Abstract: PROBLEM TO BE SOLVED: To form an extended solder bond between two electronic substrates which are mutually connected by the solder to form an electronic module, by heating the two substrates, imparting controlled separating force to the solder bond plasticized by the heat between the substrates, extending the solder bond, and refrigerating the resultant module to set the extended solder bond. SOLUTION: Solder bonds 12 having a height S are generally used for treating a printed circuit board or the like, i.e., a substrate 11, which is connected to a chip, i.e., a substrate 13. Specifically, the solder bonds 12 are formed between these two electronic substrates 11, 13 to form a mutually connected electronic module. Thereafter, the module is heated to plasticize the solder bonds 12. Subsequently, separating power is imparted to the two electronic substrates 11, 13 so as to extend the plasticized solder bonds 12, thereby forming an extended solder bond. Then, the module thus extended is refrigerated to complete the electronic module comprising the extended solder bond.
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公开(公告)号：JPH11111764A
公开(公告)日：1999-04-23
申请号：JP22771398
申请日：1998-08-12
Applicant: IBM
Inventor： PETER J BROFMAN , PATRICK A KOIKO , MARK G COURTNEY , JAMES H KOVEL II , JERZY FALUKE , LEWIS S GOLDMAN , RAYMOND A JACKSON , DAVID C LINNELL , GREGORY B MARTIN , FRANK L PONPEO , KATHLEEN A SUTATSURAA , HILTON T TOY
Abstract: PROBLEM TO BE SOLVED: To form an extended solder bond between two substrates which are mutually connected by solder to form an electronic module, by reflowing an extensible paste solder bump to extend an extension means thereof so as to raise the height of a first mutual solder connection, and forming an extended solder bond in the electronic module. SOLUTION: The distance between the upper surface of a substrate 19 and the lower surface of a substrate 16 which faces the substrate 19, is represented by C. A paste 17, which is formed on the substrate 19, is in receipt of the lower end of a reflowed solder ball 18 so as to be in contact therewith. The height of an extensible solder bump 14 is represented by B which is smaller than the height C of the solder ball 18. When the solder ball 18 is heated at a temperature high enough only to reflow itself, the substrate 16 lowers toward the substrate 19 as the solder ball 18 melts. Since the reflow temperature of the solder ball 18 is lower than that of the extensible solder bump 14, the bump 14 remains solid during the heating so as to contribute to preventing the substrate 16 from going down to the level lower than the height B.
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公开(公告)号：JPH11111776A
公开(公告)日：1999-04-23
申请号：JP22747398
申请日：1998-08-12
Applicant: IBM
Inventor： PETER J BROFMAN , PATRICK A KOIKO , MARK G COURTNEY , JERZY FALUKE , LEWIS S GOLDMAN , RAYMOND A JACKSON , DAVID C LINNELL , GREGORY B MARTIN , FRANK L PONPEO , KATHLEEN A SUTATSURAA , HILTON T TOY
Abstract: PROBLEM TO BE SOLVED: To provide a device for extending mutual connection and junction between two substrates in an electronic circuit module. SOLUTION: A device applies separating (extending) force to two substrates 16 and 28 through the use of an expandable metal 20. A lift rod 25 mounted on a clamp bridge is moved upward by the expansion of the expandable metal to lift the fixed first substrate 16. A lift bridge 17 coupled to the clamp bridge is moved downward and is kept, in contact with the second substrate 28 connected to the first substrate.
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公开(公告)号：JP2006059814A
公开(公告)日：2006-03-02
申请号：JP2005238111
申请日：2005-08-19
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： BERNIER WILLIAM E , CHENG TIEN-JEN , COLE MARIE S , EICHSTADT DAVID E , FAROOQ MUKTA G , PHIZHIMONS JOHN A , LEWIS S GOLDMAN , KNICKERBOCKER JOHN U , LOPEZ TASHA E , WELSH DAVID J
IPC: H01R11/01
CPC classification number: H01L21/563 , H01L23/3171 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13099 , H01L2224/131 , H01L2224/13566 , H01L2224/16 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01R43/0256 , H05K3/284 , H05K3/3436 , H05K2201/0133 , H05K2201/10977 , Y02P70/613 , H01L2224/29099 , H01L2224/0401
Abstract: PROBLEM TO BE SOLVED: To provide a connector surrounded with a compressive material which connects a device with a support without separation.
SOLUTION: An unleaded connector is formed on the device, the unleaded connector is surrounded with a compressive film, the device is combined with the support, i.e. the unleaded connector connects the device with the support electrically, and a clearance between the support and the device is filled with an insulation underfill. A device supporting structure constituted of these and a forming method for it are disclosed.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种被压缩材料包围的连接器，该压缩材料将装置与支撑件连接而不分离。 解决方案：在设备上形成无铅连接器，无铅连接器被压缩膜包围，该装置与支撑件组合，即，无铅连接器将该装置与支撑件电连接，支撑件之间的间隙 并且该装置填充有绝缘底部填充物。 公开了一种由它们构成的装置支撑结构及其形成方法。 版权所有（C）2006，JPO＆NCIPI
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