公开(公告)号：JPH0685096A

公开(公告)日：1994-03-25

申请号：JP16049093

申请日：1993-06-30

Applicant: IBM

Inventor： REIMONDO ROBAATO HOOTON ,  IZUMEIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA ,  UIRIAMU EDOWAADO PENSU FUOOSU

IPC: H01L23/06 ,  H01L23/14 ,  H01L23/367 ,  H01L23/373 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

Abstract: PURPOSE: To obtain a packaging structure, which is superior in points of shock resistance, electric shielding effect, convection cooling and heat transfer, by a method wherein a high-density lightweight electronic packaging device with a convection cooling function is constituted into a structure, wherein the device is encircled with a cover comprising a permeable material. CONSTITUTION: A packaging material 1, which enables the passing of the air in all directions, has a wide-ranging heat transfer power, a structural holding power and an electrical conductivity and is formed into a spongy structure which is of use as an electric shield, is prepared. In the case where this material 1 is used for a package of a component for signal processing use of an electronic device, an electronic component holding material (insulating thin film) 2 is arranged on the surface of the material 1 and a printed wiring or the like, for example, is provided on the holding material 2 as the component 4 for signal processing use. Some open parts 3 are formed in the insulating thin film 2 to allow to flow the air in the material 1. As a result, the material results in being able to be cooled all the material 1 over.