公开(公告)号：JPH0685096A

公开(公告)日：1994-03-25

申请号：JP16049093

申请日：1993-06-30

Applicant: IBM

Inventor： REIMONDO ROBAATO HOOTON ,  IZUMEIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA ,  UIRIAMU EDOWAADO PENSU FUOOSU

IPC: H01L23/06 ,  H01L23/14 ,  H01L23/367 ,  H01L23/373 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

Abstract: PURPOSE: To obtain a packaging structure, which is superior in points of shock resistance, electric shielding effect, convection cooling and heat transfer, by a method wherein a high-density lightweight electronic packaging device with a convection cooling function is constituted into a structure, wherein the device is encircled with a cover comprising a permeable material. CONSTITUTION: A packaging material 1, which enables the passing of the air in all directions, has a wide-ranging heat transfer power, a structural holding power and an electrical conductivity and is formed into a spongy structure which is of use as an electric shield, is prepared. In the case where this material 1 is used for a package of a component for signal processing use of an electronic device, an electronic component holding material (insulating thin film) 2 is arranged on the surface of the material 1 and a printed wiring or the like, for example, is provided on the holding material 2 as the component 4 for signal processing use. Some open parts 3 are formed in the insulating thin film 2 to allow to flow the air in the material 1. As a result, the material results in being able to be cooled all the material 1 over.

公开(公告)号：JPH06295977A

公开(公告)日：1994-10-21

申请号：JP21380793

申请日：1993-08-30

Applicant: IBM

Inventor： UIRIAMU EDOWAADO PENSU FUOOSU

IPC: H01L23/50 ,  H01L23/528 ,  H01L23/538 ,  H05K1/02 ,  H05K3/46 ,  H01L23/522

Abstract: PURPOSE: To provide an impedance-controllable signal and power wiring network. CONSTITUTION: In an impedance-controllable packaging network, an assembly is composed of x-direction planes 22 and y-direction planes 13 with power conductors 15, 16, 17, 24, 25, 26 and signal conductors 18, 19, 20, 21, 27, 28, 29, 30 mutually disposed thereon and insulation layers 12, 14, 23 disposed between the planes; each plane being isolated from ground planes 11, 38. The wiring network is capable of wiring many power levels with all the power conductors 15, 16, 17, 24, 25, 26 and signal conductors 18, 19, 20, 21, 27, 28, 29, 30 electrically normalized to the ground over the entire lengths and the signal conductors 18, 19, 20, 21, 27, 28, 29, 30 are electrically normalized to the power levels along their lengths. At least one of electrically conductive planes disposed between the adjacent insulation layers is electrically normalized through the insulation layer to provide at least two power conductors and at least one signal conductors.