公开(公告)号：JPH1065070A

公开(公告)日：1998-03-06

申请号：JP17667997

申请日：1997-07-02

Applicant: IBM

Inventor： MICHAEL ANTHONY GEINZU ,  JIYAINARU ABEDEIN MORA ,  STEVEN PAUL OSUTORANDAA ,  JUDITH MARIE RORUDAN ,  GEORGE JOHN SAKUSENMEIYAA ,  GEORGE FREDRIC WOLKER

IPC: H01L23/32 ,  H01L21/60 ,  H01L21/68 ,  H01R4/58

Abstract: PROBLEM TO BE SOLVED: To obtain a low-impedance and re-workable electric interconnection for electric connections without solder and dielectric adhesive film having conductive clusters for sealing capsules. SOLUTION: Recesses 12 are formed into a metal layer 10 for forming clusters 20. A photomask 16 is adhered to the top face 14 of the metal layer 10 and positioned at regions 12 to form openings 18. The interconnection clusters 20 are electroplated to form tree-like metal filaments with the clusters 10 branched. The photomask 16 is removed to leave the clusters 20 defined by the metal filaments. A dielectric adhesive layer 22 is potted round metal clusters to form a dielectric adhesive film 22 having a pattern of clusters 20 for conductive interconnection. Using this film 22, a semiconductor chip or wafer can be interconnected or capsules can be sealed.

公开(公告)号：JPH07105144A

公开(公告)日：1995-04-21

申请号：JP14278994

申请日：1994-06-24

Applicant: IBM

Inventor： REIMONDO TOOMASU GARASUKO ,  JIYAINARU ABEDEIN MORA

IPC: G06F15/173 ,  G06F15/80 ,  G11C5/00 ,  H01L23/48 ,  H01L23/52 ,  H05K1/00 ,  H05K3/00 ,  H05K3/32 ,  H05K3/46 ,  G06F15/16

Abstract: PURPOSE: To provide a method for electrically connecting pads together between panels and laminating high-molecular circuit dielectric panels. CONSTITUTION: The electric connection between pads is provided by the instantaneous liquid phase formation coupling of connecting metal featured by the composition of a non-eutectic stoichiometry in an eutectic formation system. The eutectic temperature of the system is lower than the primary transient temperature of a high-molecular dielectric 233 and the melting point of the coupling metal composition is higher than the prinary transient temperature of the high-molecular dielectric 223.