公开(公告)号：JPH1065070A

公开(公告)日：1998-03-06

申请号：JP17667997

申请日：1997-07-02

Applicant: IBM

Inventor： MICHAEL ANTHONY GEINZU ,  JIYAINARU ABEDEIN MORA ,  STEVEN PAUL OSUTORANDAA ,  JUDITH MARIE RORUDAN ,  GEORGE JOHN SAKUSENMEIYAA ,  GEORGE FREDRIC WOLKER

IPC: H01L23/32 ,  H01L21/60 ,  H01L21/68 ,  H01R4/58

Abstract: PROBLEM TO BE SOLVED: To obtain a low-impedance and re-workable electric interconnection for electric connections without solder and dielectric adhesive film having conductive clusters for sealing capsules. SOLUTION: Recesses 12 are formed into a metal layer 10 for forming clusters 20. A photomask 16 is adhered to the top face 14 of the metal layer 10 and positioned at regions 12 to form openings 18. The interconnection clusters 20 are electroplated to form tree-like metal filaments with the clusters 10 branched. The photomask 16 is removed to leave the clusters 20 defined by the metal filaments. A dielectric adhesive layer 22 is potted round metal clusters to form a dielectric adhesive film 22 having a pattern of clusters 20 for conductive interconnection. Using this film 22, a semiconductor chip or wafer can be interconnected or capsules can be sealed.

公开(公告)号：JP2008277813A

公开(公告)日：2008-11-13

申请号：JP2008108110

申请日：2008-04-17

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： KUMAR RAJNEESH ,  STEVEN PAUL OSUTORANDAA

IPC: H01L23/373 ,  H05K7/20

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a thermally conductive mixture employed for preparing a thermally conductive concoction such as a paste having a high thermal conductivity and a relatively low viscosity. SOLUTION: Disclosed is a thermally conductive mixture employed for preparing a thermally conductive concoction such as a paste having a high thermal conductivity and a relatively low viscosity. The paste provides a thermal-conductor connection between electronic parts and a cooling device to increase heat conduction between the parts and a device for cooling the electronic parts. The concoction contains a mixture with thermally conductive particles in various particle-diameter ranges dispersed typically in a non-aqueous dielectric carrier containing an antioxidant and a dispersant, in which the mixture components of thermally conductive particles are correlated in the mixture particularly through volume percentage on a particle-diameter range basis and a particle-diameter ratio for the respective particle-diameter ranges. The mixture may be applied to produce other similar products such as thermal gels, adhesives, slurries and composites, for the products such as electronics and cosmetics, medical agents, and automobiles. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供用于制备导热性混合物的导热混合物，例如具有高热导率和较低粘度的糊状物。 解决方案：公开了一种用于制备导热性混合物的导热混合物，例如具有高导热性和较低粘度的糊状物。 膏体提供电子部件和冷却装置之间的导热体连接，以增加部件之间的热传导和用于冷却电子部件的装置。 该混合物包含具有通常分散在含有抗氧化剂和分散剂的非水介电载体中的各种粒径范围内的导热颗粒的混合物，其中导热颗粒的混合组分特别是通过体积百分数 各粒径范围的粒径范围和粒径比。 该混合物可用于生产其他类似的产品，例如热凝胶，粘合剂，浆料和复合材料，用于诸如电子和化妆品，医疗剂和汽车的产品。 版权所有（C）2009，JPO＆INPIT