公开(公告)号：MY123948A

公开(公告)日：2006-06-30

申请号：MYPI9804475

申请日：1998-09-30

Applicant: IBM

Inventor： JONES GERARD WALTER ,  KEESLER ROSS WILLIAM ,  MARKOVICH VOYA RISTA ,  RUDIK WILLIAM JOHN ,  WILSON JAMES WARREN ,  WILSON WILLIAM EARL

IPC: H01K3/10 ,  H01L21/48 ,  H05K3/00 ,  H05K3/16 ,  H05K3/38 ,  H05K3/46

Abstract: A PROCESS OF FABRICATING A CIRCUITIZED SUBSTRATE IS PROVIDED WHICH COMPRISING THE STEPS OF: PROVIDING AN ORGANIC SUBSTRATE (12) HAVING CIRCUITRY (14) THEREON; APPLYING A DIELECTRONIC FILM (16, 30) ON THE ORGANIC SUBSTRATE; FORMING MICROVIAS (18) IN SAID DIELECTRIC FILM; SPUTTERING A METAL SEED LAYER (20) ON THE DIELECTRIC FILM AND IN SAID MICROVIAS; PLATING A METALLIC LAYER (22) ON THE METAL SEED LAYER; AND FORMING A CIRCUIT PATTERN THEREON.(FIGURE 1 (E))