公开(公告)号：MY123948A

公开(公告)日：2006-06-30

申请号：MYPI9804475

申请日：1998-09-30

Applicant: IBM

Inventor： JONES GERARD WALTER ,  KEESLER ROSS WILLIAM ,  MARKOVICH VOYA RISTA ,  RUDIK WILLIAM JOHN ,  WILSON JAMES WARREN ,  WILSON WILLIAM EARL

IPC: H01K3/10 ,  H01L21/48 ,  H05K3/00 ,  H05K3/16 ,  H05K3/38 ,  H05K3/46

Abstract: A PROCESS OF FABRICATING A CIRCUITIZED SUBSTRATE IS PROVIDED WHICH COMPRISING THE STEPS OF: PROVIDING AN ORGANIC SUBSTRATE (12) HAVING CIRCUITRY (14) THEREON; APPLYING A DIELECTRONIC FILM (16, 30) ON THE ORGANIC SUBSTRATE; FORMING MICROVIAS (18) IN SAID DIELECTRIC FILM; SPUTTERING A METAL SEED LAYER (20) ON THE DIELECTRIC FILM AND IN SAID MICROVIAS; PLATING A METALLIC LAYER (22) ON THE METAL SEED LAYER; AND FORMING A CIRCUIT PATTERN THEREON.(FIGURE 1 (E))

公开(公告)号：SG75906A1

公开(公告)日：2000-10-24

申请号：SG1998005900

申请日：1998-12-22

Applicant: IBM

Inventor： JONES GERALD WALTER ,  KEESLER ROSS WILLIAM ,  MARKOVICH VOYA RISTA ,  RUDIK WILLIAM JOHN ,  WILSON JAMES WARREN ,  WILSON WILLIAM EARL

IPC: H01L21/48 ,  H05K3/00 ,  H05K3/16 ,  H05K3/38 ,  H05K3/46

Abstract: A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in the dielectric film; sputtering a metal seed layer on the dielectric film and the microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.

公开(公告)号：CA2094407C

公开(公告)日：1997-04-08

申请号：CA2094407

申请日：1993-04-20

Applicant: IBM

Inventor： BANTU NAGESHWER RAO ,  BHATT ANILKUMAR CHINUPRASAD ,  KEESLER ROSS WILLIAM ,  PAPATHOMAS KONSTANTINOS ,  SINCLAIR TERRY DONALD ,  WAGNER JEROME JAMES

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  B01D1/00

Abstract: Disclosed is a method of recovering a cyclic alkylene carbonate, such as propylene carbonate, from an effluent stream of a process in which the cyclic alkylene carbonate removes an organic photoresist material from a substrate. The effluent is a cyclic alkylene carbonate effluent, e.g., a propylene carbonate effluent, of the carbonate, water, and polymeric solids. In the recovery process the cyclic alkylene carbonate effluent is fed to a heat exchanger, and separated into (i) water and volatiles, and (ii) cyclic carbonate. This lowers the concentration of water in the cyclic alkylene carbonate to a level that is low enough to substantially avoid hydrolysis of cyclic alkylene carbonate to the corresponding glycol. The dewatered cyclic alkylene carbonate is evaporated to separate the cyclic alkylene carbonate from high boiling materials and polymeric solids. The dewatered cyclic alkylene carbonate is separated into (i) a cyclic alkylene carbonate fraction, and (ii) a photoresist solids fraction. The photoresist materials fractions contains photoresist material in the alkylene carbonate. The cyclic alkylene carbonate fraction is further separated in a fractionation means into a higher vapor pressure alkylene glycol fraction, and a lower vapor pressure alkylene carbonate fraction.