公开(公告)号：SG75906A1

公开(公告)日：2000-10-24

申请号：SG1998005900

申请日：1998-12-22

Applicant: IBM

Inventor： JONES GERALD WALTER ,  KEESLER ROSS WILLIAM ,  MARKOVICH VOYA RISTA ,  RUDIK WILLIAM JOHN ,  WILSON JAMES WARREN ,  WILSON WILLIAM EARL

IPC: H01L21/48 ,  H05K3/00 ,  H05K3/16 ,  H05K3/38 ,  H05K3/46

Abstract: A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in the dielectric film; sputtering a metal seed layer on the dielectric film and the microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.

公开(公告)号：MY123948A

公开(公告)日：2006-06-30

申请号：MYPI9804475

申请日：1998-09-30

Applicant: IBM

Inventor： JONES GERARD WALTER ,  KEESLER ROSS WILLIAM ,  MARKOVICH VOYA RISTA ,  RUDIK WILLIAM JOHN ,  WILSON JAMES WARREN ,  WILSON WILLIAM EARL

IPC: H01K3/10 ,  H01L21/48 ,  H05K3/00 ,  H05K3/16 ,  H05K3/38 ,  H05K3/46

Abstract: A PROCESS OF FABRICATING A CIRCUITIZED SUBSTRATE IS PROVIDED WHICH COMPRISING THE STEPS OF: PROVIDING AN ORGANIC SUBSTRATE (12) HAVING CIRCUITRY (14) THEREON; APPLYING A DIELECTRONIC FILM (16, 30) ON THE ORGANIC SUBSTRATE; FORMING MICROVIAS (18) IN SAID DIELECTRIC FILM; SPUTTERING A METAL SEED LAYER (20) ON THE DIELECTRIC FILM AND IN SAID MICROVIAS; PLATING A METALLIC LAYER (22) ON THE METAL SEED LAYER; AND FORMING A CIRCUIT PATTERN THEREON.(FIGURE 1 (E))

公开(公告)号：SG59997A1

公开(公告)日：1999-02-22

申请号：SG1996009698

申请日：1996-05-03

Applicant: IBM

Inventor： KOSTEVA STEPHEN JOHN ,  PASSANTE DAVID MICHAEL ,  RUDIK WILLIAM JOHN ,  RUSSELL DAVID JOHN ,  WHITCOMB JONATHAN CRAIG

IPC: H01L21/60 ,  H01L21/00

Abstract: A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card.

公开(公告)号：DE3378671D1

公开(公告)日：1989-01-12

申请号：DE3378671

申请日：1983-05-25

Applicant: IBM

Inventor： RUDIK WILLIAM JOHN ,  SCHMITT GEORGE PERSHING ,  SHIPLEY JOHN FRANK

IPC: H05K3/46 ,  C09J163/10 ,  H05K3/10 ,  H05K3/38 ,  H05K7/06 ,  C09J3/16