公开(公告)号：JP2000236001A

公开(公告)日：2000-08-29

申请号：JP2000005442

申请日：2000-01-14

Applicant: IBM

Inventor： JOSEPH A BENENATTI ,  WILLIAM T CHEN ,  LISA A FANTI ,  WAYNE JOHN HOWEL ,  KNICKERBOCKER JOHN U

IPC: H01L21/56 ,  H01L21/60 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To reduce thermo-kinetic fatigue to a minimum in a flip-chip package. SOLUTION: An interposer 400 used for mounting a flip-chip is made of an organic polymer which includes an aperture 33, having a conductive plug 433 and selected in a such way that an optimum length between a substrate and a chip with a coefficient of thermal expansion in matching with the extremum of a thermal cycle temperate of the module component can be obtained. The conductive plug 433 is made of a high-temperature solder 40, provided in an inside of the aperture 33 and a low-temperature solder 45 provided to the outer side of the high-temperature solder 40. Then, a low- temperature solder 45 is subjected to reflow, while the high-temperature solder becomes solid.