公开(公告)号：DE69208415D1

公开(公告)日：1996-03-28

申请号：DE69208415

申请日：1992-09-11

Applicant: IBM

Inventor： BHATIA HARSARAN SINGH ,  INTERRANTE MARIO JOHN ,  KADAKIA SURESH DAMONDARDAS ,  STOLLER HERBERT IVAN ,  MALAVIYA SHASHI DHAR ,  MCLEOD MARK HARRISON ,  RAY SUDIPTA KUMAR

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/538 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40

Abstract: A direct distribution wiring system is provided which facilitates the effecting of repair or engineering change in a Multi-chip module (MCM) while eliminating the need for redistribution and/or buried connections between IC attachment pads and engineering change pads, thus eliminating the need for patterned conductor layers corresponding to such functions. The operation of the MCM is improved by the wiring system allowing the reduction of lumped capacitances by disconnection of defective conductors, accomplished by providing severable connectors in a direct distribution structure, as well as the elimination of redistribution wiring layers and increased IC density on the MCM. Full potential fault coverage as well as full discretion in reversible engineering changes is provided by forming all elements of the wiring system on the surface of the device.

公开(公告)号：DE69208415T2

公开(公告)日：1996-09-19

申请号：DE69208415

申请日：1992-09-11

Applicant: IBM

Inventor： BHATIA HARSARAN SINGH ,  INTERRANTE MARIO JOHN ,  KADAKIA SURESH DAMONDARDAS ,  STOLLER HERBERT IVAN ,  MALAVIYA SHASHI DHAR ,  MCLEOD MARK HARRISON ,  RAY SUDIPTA KUMAR

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/538 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40

Abstract: A direct distribution wiring system is provided which facilitates the effecting of repair or engineering change in a Multi-chip module (MCM) while eliminating the need for redistribution and/or buried connections between IC attachment pads and engineering change pads, thus eliminating the need for patterned conductor layers corresponding to such functions. The operation of the MCM is improved by the wiring system allowing the reduction of lumped capacitances by disconnection of defective conductors, accomplished by providing severable connectors in a direct distribution structure, as well as the elimination of redistribution wiring layers and increased IC density on the MCM. Full potential fault coverage as well as full discretion in reversible engineering changes is provided by forming all elements of the wiring system on the surface of the device.