公开(公告)号：JPH0920942A

公开(公告)日：1997-01-21

申请号：JP16489596

申请日：1996-06-25

Applicant: IBM

Inventor： PANAYOTEISU KONSUTANTEINU ANDO ,  HARIKURIA DERIJIYANNI ,  JIEEMUZU MATSUKERU EDOUIN HAAP ,  CHIYAO KUN FUU ,  DEIRU JIYONASAN PIASON ,  SUKOTSUTO KEBUIN REINORUZU ,  KIN NIN TOUU ,  SHIPURIAN EMEKA UZOFU

IPC: C22C9/00 ,  C22C9/02 ,  H01L21/768 ,  H01L23/48 ,  H01L23/498 ,  H01L23/532

Abstract: Copper alloys containing between 0.01 and 10 weight percent of at least one alloying element selected from carbon, indium and tin for improved electromigration resistance, low resistivity and good corrosion resistance that can be used in chip and package interconnections and a method of making such interconnections and conductors by first forming the copper alloy and then annealing it to cause the diffusion of the alloying element toward the grain boundaries between the grains in the alloy are disclosed.