公开(公告)号：JP2011079311A

公开(公告)日：2011-04-21

申请号：JP2010224565

申请日：2010-10-04

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： JONES BRADLEY P ,  KNICKERBOCKER SARAH H ,  VOLANT RICHARD PAUL

IPC: B29C33/38

CPC classification number: H01L24/742 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/131 ,  H01L2924/1431 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K3/3478 ,  H01L2924/014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for making a mold with a protective layer.
SOLUTION: The method for making the mold with the protective layer includes making a mold base plate having at least one substantially flat surface, accumulating a mold protective material layer on at least one substantially flat surface, and etching a plurality of cavities on at least one substantially flat surface through the mold protective layer.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造具有保护层的模具的方法。 用于制造具有保护层的模具的方法包括制造具有至少一个基本上平坦的表面的模具基板，在至少一个基本上平坦的表面上积聚模具保护材料层，并且在多个腔体上蚀刻多个空腔 通过模具保护层的至少一个基本平坦的表面。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2005094013A

公开(公告)日：2005-04-07

申请号：JP2004269142

申请日：2004-09-16

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： BIGGS JULIE C ,  CHENG TIEN-JEN ,  EICHSTADT DAVID E ,  FANTI LISA A ,  GRIFFITH JONATHAN H ,  KNARR RANDOLPH F ,  KNICKERBOCKER SARAH H ,  PETRARCA KEVIN S ,  QUON ROGER A ,  SAUTER WOLFGANG ,  SRIVASTAVA KAMALESH K ,  VOLANT RICHARD P

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a wire bond in an I/C chip. SOLUTION: This method comprises steps of: providing an I/C chip having a conductive pad for wire bonding and at least one dielectric material layer on the pad; forming an opening penetrating the dielectric material layer to expose a part of said pad; forming at least a first conductive layer on the exposed surface of the pad and on the surface of the opening; forming a seed layer on the first conductive layer, applying photoresist onto the seed layer; exposing the photoresist to light and developing the light-exposed photoresist; exposing the surface of the seed layer surrounding the opening; removing the exposed seed layer; removing the photoresist material inside the opening to expose the seed layer; coating at least one second conductive material layer on the seed layer inside the opening; and removing the first conductive layer on the dielectric layer around the opening. The present invention includes the structure obtained by the above method. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供在I / C芯片中形成引线键合的方法。 解决方案：该方法包括以下步骤：提供具有用于引线接合的导电焊盘和衬垫上的至少一个电介质材料层的I / C芯片; 形成贯穿所述电介质材料层的开口以露出所述垫的一部分; 在所述垫的暴露表面和所述开口的表面上形成至少第一导电层; 在所述第一导电层上形成种子层，将光致抗蚀剂施加到种子层上; 将光致抗蚀剂曝光并显影曝光的光致抗蚀剂; 暴露围绕开口的种子层的表面; 去除暴露的种子层; 去除开口内的光致抗蚀剂材料以暴露种子层; 在开口内的种子层上涂覆至少一个第二导电材料层; 以及去除围绕开口的电介质层上的第一导电层。 本发明包括通过上述方法获得的结构。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：AU2003294403A1

公开(公告)日：2005-07-14

申请号：AU2003294403

申请日：2003-11-18

Applicant: IBM

Inventor： PETRARCA KEVIN S ,  CHENG TIEN-JEN ,  KNICKERBOCKER SARAH H ,  VOLANT RICHARD P ,  WALKER GEORGE F

IPC: H01L21/302 ,  H01L21/44 ,  H01L21/461 ,  H01L21/48 ,  H01L21/50 ,  H01L23/485