公开(公告)号：US3644700A

公开(公告)日：1972-02-22

申请号：US3644700D

申请日：1969-12-15

Applicant: IBM

Inventor： KRUPPA ROBERT W ,  WEBER EDWARD V ,  WOODARD OLLIE C

IPC: H01J37/30 ,  G05B19/39 ,  H01J37/304 ,  H01L21/00 ,  H01L21/027 ,  B23K9/08

CPC classification number: H01J37/3045 ,  G05B19/39 ,  G05B2219/42251 ,  H01L21/00

Abstract: A square-shaped electron beam is stepped from one predetermined position to another to form a desired pattern on each chip of a semiconductor wafer to which the beam is applied. For each chip to which the beam is applied, the position of the chip relative to a predetermined position is determined and the distance in these positions is utilized to control the position of the electron beam to insure that the desired pattern is formed on each of the chips separately. Furthermore, the position of the beam is periodically checked against a calibration grid to ascertain any deviations in the beam from its initial position. These differences are applied to properly position the beam.

公开(公告)号：US3612692A

公开(公告)日：1971-10-12

申请号：US3612692D

申请日：1968-11-21

Applicant: IBM

Inventor： KRUPPA ROBERT W ,  WARD ERNEST S

IPC: G01B11/06 ,  G05D5/03 ,  G01B9/02

CPC classification number: G05D5/03 ,  G01B11/0675

Abstract: An automatic thickness monitoring and control system and method for monitoring the growth of a dielectric film on a reflective substrate such as a silicon wafer during an RF sputtering deposition process and for stopping the deposition process when the film reaches a predetermined thickness. The successive minima (or maxima) in the interference pattern of light reflected from the wafer are counted to determine the film thickness and the sputtering is stopped at a predetermined count. In another embodiment, sputtering is stopped by interpolation between counts.

公开(公告)号：JP2006146901A

公开(公告)日：2006-06-08

申请号：JP2005318184

申请日：2005-11-01

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： KRUPPA ROBERT W ,  PRAKASH RAVINDER

IPC: G06K9/03 ,  G06K9/20 ,  G06K9/62

CPC classification number: G06K9/186

Abstract: PROBLEM TO BE SOLVED: To disclose an apparatus, system and method for detecting fraudulent character.
SOLUTION: A first optical character recognition module optically recognizes a character transcripted with a magnetic ink on a medium using a first optical character recognition algorithm. A second optical character recognition module also optically recognizes the character using a second optical character recognition algorithm. In addition, a magnetic ink character recognition module magnetically recognizes the character using a magnetic recognition algorithm. A voting module determines if the character is potentially fraudulent based on the recognition results of the first optical character recognition module, the second optical character recognition module, and the magnetic ink character recognition module. If the character is potentially fraudulent, a results module communicates a fraud indicator.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：公开用于检测欺诈性的装置，系统和方法。 解决方案：第一光学字符识别模块使用第一光学字符识别算法在介质上光学识别用磁性墨水转录的字符。 第二光学字符识别模块还使用第二光学字符识别算法来光学识别角色。 此外，磁性墨水字符识别模块使用磁性识别算法磁性识别角色。 基于第一光学字符识别模块，第二光学字符识别模块和磁性墨水字符识别模块的识别结果，投票模块确定该角色是否具有潜在的欺诈性。 如果角色潜在地是欺诈性的，则结果模块传达欺诈指示符。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：FR2335959A1

公开(公告)日：1977-07-15

申请号：FR7634521

申请日：1976-11-08

Applicant: IBM

Inventor： LOVE ROBERT D ,  CULLEN JAMES W ,  KRUPPA ROBERT W

IPC: H01L21/82 ,  H01L27/04 ,  H01L21/822 ,  H01L27/088 ,  H01L27/118 ,  H01L29/78 ,  H03K3/356 ,  H03K19/0944 ,  H01L27/08 ,  H03K19/08

Abstract: A depletion mode load device structure is disclosed which improved upon the existing Weinberger layout technique, as applied to enhancement mode/depletion mode circuitry. The structure of an FET, self biased load device includes a single metallized vertical line performing three functions: a source contact for the FET device, the gate electrode for the FET device, and the output line for the circuit for which the device serves as the load. Use of this structure results in an increased horizontal circuit packing density, which is particularly useful in the decoder circuits for a programmed logic array.

公开(公告)号：CA942429A

公开(公告)日：1974-02-19

申请号：CA99714

申请日：1970-12-03

Applicant: IBM

Inventor： KRUPPA ROBERT W ,  WEBER EDWARD V ,  WOODARD OLLIE C

IPC: H01J37/30 ,  G05B19/39 ,  H01J37/304 ,  H01L21/00 ,  H01L21/027

Abstract: 1329559 Programmed control INTERNATIONAL BUSINESS MACHINES CORP 3 Dec 1970 [15 Dec 1969] 57380/70 Heading G3N [Also in Division H1] A beam of charged particles, scanning in a raster over a workpiece, is precisely positioned by determining beam error with respect to a reference position, storing the error and correcting the raster position accordingly. As shown, an electron beam from a gun 10 is directed through a square aperture 12, which shapes it to a beam 11 of a size equal to the minimum line width of a raster pattern to be formed on a workpiece mounted on a table 29. The beam is electro-magnetically focussed by a coil 15 and passes between blanking plates 16. The beam 11 is then passed through a circular aperture 19, which passes only axial charged particles, so that a square shaped spot without distortion is produced. The beam is subjected to co-ordinate deflections by electromagnetic coils 21-24 and electro-static plates 25-28. The table 29 is moved in co-ordinate directions by motors 30, 31, 31'. To ascertain the correct focus and astigmatism of the beam 11 a grid 47 of copper foil is mounted on the table and the focus detected by a PIN diode, not shown, the output of which through an interface circuit 17 is interrogated by a computer 18 which provides signals to the circuit 17 for control of the electron beam. The calibration of the beam 11 is ascertained by use of a grid 60 of copper foil having a pattern with accurately dimensioned square openings. The beam is detected by a PIN diode, not shown, and the error is determined by and stored within the computer for subsequent use during the execution of a programmed electron beam machining operation on chips on a semi-conductor substrate positioned by co-ordinate movement of the table. The beam is moved across the substrate in a raster pattern by signals from the interface circuit to coils 21-24 under control of the computer and correction signals applied to plates 25-28. The beam is held stationary in a position determined by the programme by the application of a bucking sawtooth waveform to the X electrostatic plates 25, 26. It is stated that the electrostatic plates 25-26 could be replaced by high frequency electromagnetic coils and the focus grid 47 omitted and the calibration grid 60 utilized for focusing. Facilities are provided whereby, on substitution of a substrate, the table can be rotated by a motor, not shown, to the align the substrate with the scanning directions.

公开(公告)号：CA868092A

公开(公告)日：1971-04-06

申请号：CA868092D

Applicant: IBM

Inventor： WARD ERNEST S ,  KRUPPA ROBERT W