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公开(公告)号：CA1223782A
公开(公告)日：1987-07-07
申请号：CA508355
申请日：1986-05-05
Applicant: IBM
Inventor： HOFER DONALD C , LA VERGNE DEBRA B , TWIEG ROBERT J , VOLKSEN WILLI
IPC: H01L23/24
Abstract: PROCESS FOR PLANARIZING A SUBSTRATE A surface coating of high glass temperature and superior mechanical properties along with excellent planarization and gap filling is used to coat substrates. The coating comprises a polyamide alkyl ester from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220.degree.C.
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