PROCESS FOR PLANARIZING A SUBSTRATE

    公开(公告)号:CA1223782A

    公开(公告)日:1987-07-07

    申请号:CA508355

    申请日:1986-05-05

    Applicant: IBM

    Abstract: PROCESS FOR PLANARIZING A SUBSTRATE A surface coating of high glass temperature and superior mechanical properties along with excellent planarization and gap filling is used to coat substrates. The coating comprises a polyamide alkyl ester from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220.degree.C.

    PRINTING MEDIUM AND USE THEREOF
    2.
    发明专利

    公开(公告)号:CA1184031A

    公开(公告)日:1985-03-19

    申请号:CA441820

    申请日:1983-11-24

    Applicant: IBM

    Abstract: PRINTING MEDIUM AND USE THEREOF A printing medium which includes a substrate coated with a compound of the formula: wherein R3 is a ring group having certain substituents in at least one ortho position with respect to the atom connected to C = 0; and each R1 and R2 individually is aryl or alkaryl or are interconnected to form with the nitrogen atom a phenothiazine, phenoxazine, or phenazine or substituted derivative; and coated with an oxidizing agent or reduced form thereof; and method of use. EN9-82-028

Patent Agency Ranking