公开(公告)号：JPH11315479A

公开(公告)日：1999-11-16

申请号：JP5221999

申请日：1999-03-01

Applicant: IBM

Inventor： BERND K APPERT ,  LAWRENCE R BRAMBERG ,  WILLIAM T FOTONY ,  ROSS D HARVENS ,  ROBERT M JAPPU ,  PAPATHOMAS KOSTAS ,  YAN OBUJIMATO ,  MARK D POLIKS ,  AMARUJITO S RAAI

IPC: B32B5/02 ,  B29B11/16 ,  B29B15/10 ,  D06M15/41 ,  D06M101/00 ,  H01L23/00 ,  H01L23/08 ,  H01L23/14 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To obtain a textile/resin composite material with high electrical insulation suitable for electronic packages by coating a cloth member having a specified maximum thickness and containing particles at low levels with a specific curable resin material. SOLUTION: This textile material having an insulation resistance of as high as about 1,000,000 Ω or greater after subjecting to HAST test is obtained by coating a woven fabric made of glass fiber strand, having a specified maximum thickness and containing =145 deg.C in glass transition temperature such as phenolic resin followed by at least partially curing the resin material.