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    POWER SOURCE/GROUND CORE, PRINTED CIRCUIT BOARD AND MANUFACTURE OF PRINTED CIRCUIT BOARD
    3.
    发明专利
    POWER SOURCE/GROUND CORE, PRINTED CIRCUIT BOARD AND MANUFACTURE OF PRINTED CIRCUIT BOARD 失效

    公开(公告)号：JP2000323840A

    公开(公告)日：2000-11-24

    申请号：JP2000123963

    申请日：2000-04-25

    Applicant: IBM

    Inventor： ROBERT M JAPPU ,  MARK D POLIKS

    IPC: H05K1/02 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

    Abstract: PROBLEM TO BE SOLVED: To provide a power source plane and ground plane which are used in a printed circuit board(PCB) containing porous conductive material. SOLUTION: Porous material for a power source plane 202 and a ground plane 205 is used in a PCB so that fluid (for example, water or other solvent) can pass through the power source plane and the ground plane. Therefore, defects in a PCB caused by growth of a cathode/anode filament or peeling of an insulating layer are reduced. Porous conductive material suitable for use in a PCB is made porous by forming an array of holes in a metal-coated organic cloth (polyester, liquid-crystal polymer or the like), cloth (made of carbon/graphite fiber, glass fiber or the like), metal wire mesh, sintered metal or metal sheet.

    POROUS POWER AND GROUND PLANES FOR REDUCED PCB DELAMINATION AND BETTER RELIABILITY
    5.
    发明专利
    POROUS POWER AND GROUND PLANES FOR REDUCED PCB DELAMINATION AND BETTER RELIABILITY 未知

    公开(公告)号：MY125420A

    公开(公告)日：2006-07-31

    申请号：MYPI20001268

    申请日：2000-03-29

    Applicant: IBM

    Inventor： ROBERT M JAPP ,  MARK D POLIKS

    IPC: H05K1/02 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

    Abstract: POWER AND GROUND PLANES THAT ARE USED IN PRINTED CIRCUIT BOARDS (PCBS) AND THAT COMPRISE POROUS, CONDUCTIVE MATERIALS ARE DISCLOSED. USING POROUS POER AND GROUND PLANE MATERIALS IN PCBS ALLOWS LIQUIDS (E.G., WATER AND/OR OTHER SOLVENTS) TO PASS THROUGH THE POWER AND GROUNDS PLANES, THUS DECREASING FAILURES IN PCBS (OR PCBS USED AS LAMINATE CHIP CARRIERS) CAUSED BY CATHODIC/ ANODIC FILAMENT GROWTH AND DELAMATION OF INSULATORS. POROUS CONDUCTIVE MATERIALS SUITABLE FOR USE IN PCBS MAY BE FORMED BY USING METAL COATED ORGANIC CLOTHS (SUCH AS POLYSTER ORLIQUID CRYSTAL POLYMERS) OR FABRICS (SUCH AS THOSE MADE FROM CARBON/GRAPHITE OR GLASS FIBERS), USING METAL WIRE MESH INSTEAD OF METAL SHEETS, USING SINTERED METAL, OR MAKING METAL SHEETS POROUS BY FORMING AN ARRAY OF HOLES IN THE METAL SHEETS. FABRICS AND MESH MAY BE WOVEN OR RANDOM. IF AN ARRAY OF HOLED IS FORMED IN A METAL SHEET, SUCH AN ARRAY MAY BE FORMED WITH NO ADDITIONAL PROCESSING STEPS THAN ARE PERFORMED USING CONVENTIONAL PCB ASSEMBLY METHODS.(FIG.1)

    LOW CTE POWER AND GROUND PLANES
    7.
    发明专利
    LOW CTE POWER AND GROUND PLANES 未知

    公开(公告)号：SG97874A1

    公开(公告)日：2003-08-20

    申请号：SG200001741

    申请日：2000-03-24

    Applicant: IBM

    Inventor： ROBERT M JAPP ,  MARK D POLIKS

    IPC: H05K1/03 ,  H05K3/46

    Abstract: Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz, polyethylene, and liquid crystal polymer fibers) with low CTEs are metallized to provide a resultant conductive material with a low CTE. Such fibers may be metallized in their individual state and then formed into a fabric, or these materials may be formed into a fabric and then metallized or a combination of both metallizations may be used. In addition, a graphite or carbon sheet may be metallized on one or both sides to provide a material that has a low CTE and high conductivity. These metallized, low CTE power and ground planes may be laminated with other planes/cores into a composite, or laminated into a core which is then laminated with other planes/cores into a composite. The resultant composite may be used for printed circuit boards (PCBs) or PCBs used as laminate chip carriers.

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