公开(公告)号：JP2001326470A

公开(公告)日：2001-11-22

申请号：JP2001087939

申请日：2001-03-26

Applicant: IBM

Inventor： DONS FRANCIS J JR ,  FARQUHAR DONALD S ,  FOUST ELIZABETH ,  ROBERT M JAPPU ,  JONES GERALD W ,  JOHN S KURIIJU ,  ROBERT D SEBESUTA ,  DAVID B STONE ,  JAMES R WILCOCKS

IPC: H05K1/02 ,  H01L23/12 ,  H01L23/14 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide an electronic package and a method of manufacturing the electronic package. SOLUTION: A package 10 is provided with a semiconductor chip 12 and a multilayer interconnection structure 18 having an allyl surface layer. The semiconductor chip 12 has a plurality of contact members 16 on one surface, and is connected with the inside of the multilayer interconnection structure 18 by using a plurality of solder connecting members 20. The multilayer interconnection structure 18 is constituted so as to electrically and interconnect circuits of a board 100 by using a plurality of other solder connecting members 47 and has a heat conduction layer 22 composed of material having a selected thickness and coefficient of thermal expansion with which solder connecting obstruction between a plurality of first conducting members and the semiconductor chip is prevented totally. The electronic package 10 includes dielectric material having effective tensile stress for ensuring sufficient compliancy with the multilayer interconnection structure 18 during operation. The allyl surface layer has characteristic capable of enduring thermal stress which is generated during heat cycle operation of the electronic package 10.

公开(公告)号：JP2000323840A

公开(公告)日：2000-11-24

申请号：JP2000123963

申请日：2000-04-25

Applicant: IBM

Inventor： ROBERT M JAPPU ,  MARK D POLIKS

IPC: H05K1/02 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a power source plane and ground plane which are used in a printed circuit board(PCB) containing porous conductive material. SOLUTION: Porous material for a power source plane 202 and a ground plane 205 is used in a PCB so that fluid (for example, water or other solvent) can pass through the power source plane and the ground plane. Therefore, defects in a PCB caused by growth of a cathode/anode filament or peeling of an insulating layer are reduced. Porous conductive material suitable for use in a PCB is made porous by forming an array of holes in a metal-coated organic cloth (polyester, liquid-crystal polymer or the like), cloth (made of carbon/graphite fiber, glass fiber or the like), metal wire mesh, sintered metal or metal sheet.

公开(公告)号：JPH11315479A

公开(公告)日：1999-11-16

申请号：JP5221999

申请日：1999-03-01

Applicant: IBM

Inventor： BERND K APPERT ,  LAWRENCE R BRAMBERG ,  WILLIAM T FOTONY ,  ROSS D HARVENS ,  ROBERT M JAPPU ,  PAPATHOMAS KOSTAS ,  YAN OBUJIMATO ,  MARK D POLIKS ,  AMARUJITO S RAAI

IPC: B32B5/02 ,  B29B11/16 ,  B29B15/10 ,  D06M15/41 ,  D06M101/00 ,  H01L23/00 ,  H01L23/08 ,  H01L23/14 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To obtain a textile/resin composite material with high electrical insulation suitable for electronic packages by coating a cloth member having a specified maximum thickness and containing particles at low levels with a specific curable resin material. SOLUTION: This textile material having an insulation resistance of as high as about 1,000,000 Ω or greater after subjecting to HAST test is obtained by coating a woven fabric made of glass fiber strand, having a specified maximum thickness and containing =145 deg.C in glass transition temperature such as phenolic resin followed by at least partially curing the resin material.