公开(公告)号：WO2014039492A4

公开(公告)日：2014-05-22

申请号：PCT/US2013057945

申请日：2013-09-04

Applicant: IBM

Inventor： LEE BENJAMIN ,  PROESEL JONATHAN ,  RYLYAKOV ALEXANDER V ,  SCHOW CLINT L

IPC: G06F17/50 ,  H04Q11/00

CPC classification number: G06F17/5045 ,  G06F17/5009 ,  G06F2217/02 ,  G06F2217/08 ,  G06F2217/84

Abstract: Designing a photonics switching system (200) is provided. A photonic switch diode (204) is designed to attain each performance metric in a plurality of performance metrics associated with a photonic switching system (200) based on a weighted value corresponding to each of the plurality of performance metrics (704). A switch driver circuit (202) is selected from a plurality of switch driver circuits for the photonic switching system (706). It is determined whether each performance metric associated with the photonic switching system (200) meets or exceeds a threshold value corresponding to each of the plurality of performance metrics based on the photonic switch diode (204) designed and the switch driver circuit (202) selected (708). In response to determining that each performance metric associated with the photonic switching system (200) meets or exceeds the threshold value corresponding to each of the performance metrics, the photonic switching system (200) is designed using the photonic switch diode (204) designed and the switch driver circuit (202) selected (710).

Abstract translation: 设计了一个光子切换系统（200）。 光子开关二极管（204）被设计为基于与多个性能度量（704）中的每一个相对应的加权值来获得与光子交换系统（200）相关联的多个性能度量中的每个性能度量。 从用于光子切换系统（706）的多个开关驱动器电路中选择开关驱动器电路（202）。 基于设计的光开关二极管（204）和选择的开关驱动电路（202），确定与光子交换系统（200）相关联的每个性能度量是否满足或超过对应于多个性能度量中的每一个的阈值 （708）。 响应于确定与光子切换系统（200）相关联的每个性能度量符合或超过对应于每个性能度量的阈值，使用设计的光子开关二极管（204）来设计光子交换系统（200），并且 选择开关驱动电路（202）（710）。

公开(公告)号：GB2508543A

公开(公告)日：2014-06-04

申请号：GB201403272

申请日：2012-07-27

Applicant: IBM

Inventor： DOANY FUAD E ,  LEE BENJAMIN ,  SCHOW CLINT L

IPC: G02B6/42 ,  G02B6/30

Abstract: A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip (200) and a lens array coupling element (100). The photonic chip includes a waveguide (202) at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array (102) that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang (104) on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface (1 12) that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.