Abstract:
A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip (200) and a lens array coupling element (100). The photonic chip includes a waveguide (202) at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array (102) that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang (104) on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface (112) that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.
Abstract:
A method of fabricating a dielectric film comprising atoms of Si, C, O and H (hereinafter SiCOH) that has improved insulating properties as compared with prior art dielectric films, including prior art SiCOH dielectric films that are not subjected to the inventive deep ultra-violet (DUV) is disclosed. The improved properties include reduced current leakage which is achieved without adversely affecting (increasing) the dielectric constant of the SiCOH dieletric film. In accordance with the present invention, a SiCOH dielectric film exhibiting reduced current leakage and improved reliability is obtained by subjecting an as deposited SiCOH dielectric film to a DUV laser anneal. The DUV laser anneal step of the present invention likely removes the weakly bonded C from the film, thus improving leakage current.
Abstract:
A method for preparing a alignment layer surface provides a surface on the alignment layer. A chemically modified surfae [117] is formed as a result of quenching and/or ion beam treatment in accordance with the present invention, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Layer [117] is now substantially free from dangling bonds and free radicals which could degrade properties of a liquid crystal display. Now, a substrate [101] is formed for use in a liquid crystal displax device. Another method for preparing an alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.
Abstract:
An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. The system includes a quarter wave plate positioned to suppress stray reflection from the projection lens. The system also includes a second quarter wave plate disposed on the screen and a polarizing film disposed on the second quarter wave plate to suppress ambient light from illuminating the screen and entering the system.
Abstract:
An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. The illumination system includes a light tunnel having a cross-sectional shape corresponding to the geometrical shape of the spacial light modulator to optimize the amount of light projected onto the screen.
Abstract:
Eine photonische integrierte Schaltungsvorrichtung wird offenbart. Die Vorrichtung weist einen photonischen Chip (200) und ein Lisen-Array-Kopplungselement (100) auf. Der photonische Chip weist einen Wellenleiter (202) an einer Seitenrandfläche des photonischen Chip auf. Das Kopplungselement mit einer Linsenanordnung ist auf einer oberen Oberfläche des photonischen Chip und auf der Seitenrandfläche angebracht. Das Kopplungselement enthält eine Linsen-Array (102), die so konfiguriert ist, dass sie Punktgrößen von Licht ändert, das sich zu dem Wellenleiter hin oder von dem Wellenleiter weg bewegt. Das Kopplungselement weist ferner einen Überstand (104) auf einer Seite des Kopplungselements auf, der sich gegenüber der Linsenanordnung befindet und der an die obere Oberfläche des photonischen Chip angrenzt. Der Überstand beinhaltet eine senkrechte Anschlagfläche (112), die eine Tiefe aufweist, die so konfiguriert ist, dass sie einen Rand des Wellenleiters mit einer Brennweite der Linsenanordnung waagrecht ausrichtet und Brennpunkte der Linsenanordnung mit dem Rand des Wellenleiters senkrecht ausrichtet.
Abstract:
A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.
Abstract:
An optical system is described consisting of reflection birefringent light valves, polarizing beam splitter, color image combining prisms, illumination system, projection lens, filters for color and contrast control, and screen placed in a configuration offering advantages for a high resolution color display. The system includes a quarter wave plate positioned to suppress stray reflection from the projection lens. The system also includes a second quarter wave plate disposed on the screen and a polarizing film disposed on the second quarter wave plate to suppress ambient light from illuminating the screen and entering the system.
Abstract:
A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.