公开(公告)号：GB2330238A

公开(公告)日：1999-04-14

申请号：GB9721440

申请日：1997-10-10

Applicant: IBM

Inventor： LEES STUART ,  GLANCY NOEL PATRICK

IPC: H05K13/04

Abstract: Apparatus is disclosed for providing a visual indication of the proper merger of the conductive pins (34) of an electrical component (30) in the corresponding vias (72) of a printed circuit board. The apparatus includes an inspection plate (50) which has a plurality of channels (55) defined between first and second opposite faces. In the channels are mounted a plurality of inspection pins (56) which move between a rest position (countersunk with respect to the top surface of the inspection plate) and an extended position (flush with the top surface). The inspection pins in the plate correspond in number and configuration to the component conductive pins but have a greater cross sectional area than that of the conductive pins. When the component is merged with the printed circuit board, each connector pin passes through the corresponding circuit board via and pushes against the corresponding inspection pin to cause it to move to the extended position. If the conductive pin is bent or deformed, the inspection pin remains in the rest position. In this way the apparatus operator is provided with a visual indication of which conductive pins have not merged correctly with the circuit board.

公开(公告)号：GB2330238B

公开(公告)日：2002-05-01

申请号：GB9721440

申请日：1997-10-10

Applicant: IBM

Inventor： LEES STUART ,  GLANCY NOEL PATRICK

IPC: H05K13/04

公开(公告)号：GB2353745A

公开(公告)日：2001-03-07

申请号：GB9919166

申请日：1999-08-14

Applicant: IBM

Inventor： ROBERTSON BRIAN LESLIE ,  LEES STUART

IPC: H01L21/00 ,  H05K13/04

Abstract: Apparatus for severing the connection made by solder balls 112 to remove a ball grid array package 102 from a substrate 100, comprises a flexible loop of diamond grit wire 202 running over at least two tension pulleys 206 and a drive pulley 204, the tension pulleys being located so as to position the cutting member between the ball grid array package and the substrate. Alternatively an adjustment mechanism may be provided to locate the abrading wire.

公开(公告)号：GB2289235A

公开(公告)日：1995-11-15

申请号：GB9409000

申请日：1994-05-06

Applicant: IBM

Inventor： FRENCH WILLIAM ,  LEES STUART ,  MCCALL COLIN DAVID ,  MURRAY KENNETH SKENE ,  ROBERTSON BRIAN

IPC: B23K1/012 ,  B23K1/018 ,  H05K3/34 ,  H05K13/04

Abstract: A tool for soldering pin-in-hole electronic circuit components includes a tool plate (10) with a set of holes (15) corresponding to the vias of a circuit board on which a circuit component is to be soldered. The board is aligned with the tool plate and hot gas is supplied through the set of holes to reflow solder in the vias. The tool is particularly suitable for use in removing a replacing circuit components. Use of particular gases allows soldering to be carried out without use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board.