公开(公告)号：JPH1098014A

公开(公告)日：1998-04-14

申请号：JP22767697

申请日：1997-08-25

Applicant: IBM ,  SIEMENS AG

Inventor： DINKEL BETTINA A ,  LEE PEI-ING ,  LEVINE ERNEST N

IPC: H01L21/301 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/78 ,  H01L23/52

Abstract: PROBLEM TO BE SOLVED: To obtain a crack stopper structure, which enhances crack stopping performance by a redundant energy releasing structure. SOLUTION: A redundant pattern enables absorbing a crack propagation energy which has not been absorbed by a first ring made by metallization by a second line made by metallization and to provide a surface area larger than the diffusion of crack-propagation energy. A redundant crack stopper 10 is manufactured during metallization operation with the rest of wiring on the surface of a chip 20. Accordingly, no additional manufacturing operation is needed to form a stopper structure.

公开(公告)号：DE3676832D1

公开(公告)日：1991-02-21

申请号：DE3676832

申请日：1986-02-07

Applicant: IBM

Inventor： BLAKESLEE MARYBELLE C ,  CHANCE DUDLEY AUGUSTUS ,  EASTMAN DEAN ERIC ,  GNIEWEK JOHN J ,  HO CHUNG WEN ,  LEVINE ERNEST N ,  ORDONEZ JOSE E ,  REILEY TIMOTHY CLARK ,  SKARVINKO EUGENE R

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40