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公开(公告)号:DE68918380T2
公开(公告)日:1995-03-30
申请号:DE68918380
申请日:1989-07-12
Applicant: IBM
Inventor: ARLDT BRIAN D , BRUHN PETER H , BULLER LAWRENCE M , LEDERMANN PETER G , LINAM STEPHEN D , MCNELIS BARBARA J , MOK LAWRENCE S , MOSKOWITZ PAUL A
Abstract: An integrated circuit chip package is described wherein the chip (18) has an active face including a plurality of input and output pads (30). The chip is mounted face down on a plurality of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board (26). A convective heat sink (32) is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden accelerations. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points (60) which are physically connected to the underlying circuit board via resilient connecting means.
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公开(公告)号:DE68918380D1
公开(公告)日:1994-10-27
申请号:DE68918380
申请日:1989-07-12
Applicant: IBM
Inventor: ARLDT BRIAN D , BRUHN PETER H , BULLER LAWRENCE M , LEDERMANN PETER G , LINAM STEPHEN D , MCNELIS BARBARA J , MOK LAWRENCE S , MOSKOWITZ PAUL A
Abstract: An integrated circuit chip package is described wherein the chip (18) has an active face including a plurality of input and output pads (30). The chip is mounted face down on a plurality of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board (26). A convective heat sink (32) is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden accelerations. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points (60) which are physically connected to the underlying circuit board via resilient connecting means.
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