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公开(公告)号:DE3671482D1
公开(公告)日:1990-06-28
申请号:DE3671482
申请日:1986-01-07
Applicant: IBM
Inventor: BABU SURYADEVARA VIJAYAKUMAR , LU NENG-HSING , NILSEN CARL-OTTO
IPC: H01L21/302 , C23C14/56 , C23C16/54 , C23F4/00 , H01L21/3065 , H05K3/00 , H01J37/32 , H05H1/46
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公开(公告)号:DE3669951D1
公开(公告)日:1990-05-03
申请号:DE3669951
申请日:1986-01-07
Applicant: IBM
Inventor: LO JOHN CHOUNG-LIN , LU NENG-HSING
IPC: H05H1/46 , C23F4/00 , H01J37/32 , H01L21/302 , H01L21/3065 , H05K3/00 , C23C14/34 , C23C16/50
Abstract: In the system, a hollow electrode (70) having two major surfaces and a plurality of apertures (72) in both major surfaces is disposed in the chamber. Connected to this hollow electrode is a radio frequency power source (76) for generating an electrical field. A second hollow electrode (78) also having two major surfaces with a plurality of apertures in both surfaces is disposed opposite the first electrode (70). A second radio frequency power source (80) is connected to the second electrode. A substrate (74) is placed in the chamber between the first and second electrodes. Provision (94,96,98, 100; 106) is made for introducing a gas to be converted in a reactive species by the radio frequency electrical field so that gas is uniformly distributed across the substrate.
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公开(公告)号:DE3667895D1
公开(公告)日:1990-02-01
申请号:DE3667895
申请日:1986-01-07
Applicant: IBM
IPC: C23F4/00 , H01J37/32 , H01L21/302 , H01L21/3065 , H05H1/46 , H05K3/00 , C23C14/40 , C23C16/50
Abstract: A system for generating a substantially uniform plasma for processing a substrate (32) having two major surfaces, each with electrically conductive portions. Two electrodes (28,30) are oppositely disposed with respect to one another on either side of the substrate. A first r.f. power source (34) is electrically connected to the first electrode (28) and a second r.f. power source (36) is electrically connected to the second electrode (30). The first and second r.f. power sources are out of phase with respect to one another, resulting in the generation of a substantially uniform plasma field.
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