公开(公告)号：US3569607A

公开(公告)日：1971-03-09

申请号：US3569607D

申请日：1969-08-01

Applicant: IBM

Inventor： MARTYAK JOHN E ,  REEBER MORTON D ,  WURMS CHARLES

IPC: H01R4/02 ,  B23K1/00 ,  H01R4/00 ,  H01R12/57 ,  H05K1/03 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H05K3/32

CPC classification number: H01R12/57 ,  H05K1/0306 ,  H05K3/3421 ,  H05K3/4015 ,  H05K2201/09481 ,  H05K2201/1031 ,  H05K2201/10704 ,  H05K2201/2081 ,  Y02P70/611 ,  Y02P70/613

Abstract: This patent discloses a resolderable connector particularly adapted for interconnecting multilayer modules with circuit boards and the like, but not limited thereto, the multilayer modules including a monolithic ceramic body with interconnected electrical conductors bonded to the ceramic. The modules include conductive terminations on at least one of the external surfaces of the ceramic body. Connected to these external conductive terminations are cuplike receptacles having a good solder wettable interior and a poor solder wettable exterior, the cuplike receptacles being connected to the conductive terminations as by brazing, but at any rate by a means having a higher melting temperature than conventional lead-tin solder so that bringing the receptacles to a temperature to heat the solder so that they may receive pins from projecting circuit boards does not cause release of the receptacles from the ceramic body.