公开(公告)号：US3916266A

公开(公告)日：1975-10-28

申请号：US42449073

申请日：1973-12-13

Applicant: IBM

Inventor： BENNETT MARVIN ,  NUCCIO CARLO ,  WURMS CHARLES

IPC: H05K1/14 ,  H01L21/768 ,  H01L23/13 ,  H01L23/52 ,  H01L23/522 ,  H01L23/538 ,  H01L25/00 ,  H05K1/00 ,  H05K1/05 ,  H05K7/20 ,  H02B1/00

CPC classification number: H01L23/5385 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0284 ,  H05K1/053 ,  H05K1/056 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/0999 ,  H01L2924/00

Abstract: A package for interconnecting a plurality of integrated circuit chips including a dielectric body having a plurality of intersecting planes and a plurality of metallized interconnection patterns located thereon. Conductive interconnecting lines connected to at least some of said metallized patterns located on different intersecting planes provide inter-plane electrical continuity, and input/output connectors connect to at least one of the metallized patterns for connecting to the outside world.

Abstract translation: 一种用于互连多个集成电路芯片的封装，包括具有多个相交平面的绝缘体和位于其上的多个金属化互连图案。 连接到位于不同交叉平面上的至少一些所述金属化图案的导电互连线提供了平面间电连续性，并且输入/输出连接器连接至至少一个金属化图案以连接到外界。

公开(公告)号：US3569607A

公开(公告)日：1971-03-09

申请号：US3569607D

申请日：1969-08-01

Applicant: IBM

Inventor： MARTYAK JOHN E ,  REEBER MORTON D ,  WURMS CHARLES

IPC: H01R4/02 ,  B23K1/00 ,  H01R4/00 ,  H01R12/57 ,  H05K1/03 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H05K3/32

CPC classification number: H01R12/57 ,  H05K1/0306 ,  H05K3/3421 ,  H05K3/4015 ,  H05K2201/09481 ,  H05K2201/1031 ,  H05K2201/10704 ,  H05K2201/2081 ,  Y02P70/611 ,  Y02P70/613

Abstract: This patent discloses a resolderable connector particularly adapted for interconnecting multilayer modules with circuit boards and the like, but not limited thereto, the multilayer modules including a monolithic ceramic body with interconnected electrical conductors bonded to the ceramic. The modules include conductive terminations on at least one of the external surfaces of the ceramic body. Connected to these external conductive terminations are cuplike receptacles having a good solder wettable interior and a poor solder wettable exterior, the cuplike receptacles being connected to the conductive terminations as by brazing, but at any rate by a means having a higher melting temperature than conventional lead-tin solder so that bringing the receptacles to a temperature to heat the solder so that they may receive pins from projecting circuit boards does not cause release of the receptacles from the ceramic body.

公开(公告)号：DE3273808D1

公开(公告)日：1986-11-20

申请号：DE3273808

申请日：1982-04-07

Applicant: IBM

Inventor： COSGROVE JAMES FRANCIS ,  DAHLKE GERHARD PAUL ,  WURMS CHARLES

IPC: C23C14/14 ,  C23C14/24 ,  C23C14/26

Abstract: The method and apparatus for coating workpieces (16) with a material involves boatless evaporation of the end of a wire or rod (12) made of said material. The end of the wire is heated by a radiant or inductive heater (14) to form a molten convex meniscus (13) thereon which serves as the coating source in the vacuum chamber (23).

公开(公告)号：DE2451211A1

公开(公告)日：1975-06-26

申请号：DE2451211

申请日：1974-10-29

Applicant: IBM

Inventor： BENNETT MARVIN ,  NUCCIO CARLO ,  WURMS CHARLES

IPC: H05K1/14 ,  H01L21/768 ,  H01L23/13 ,  H01L23/52 ,  H01L23/522 ,  H01L23/538 ,  H01L25/00 ,  H05K1/00 ,  H05K1/05 ,  H05K7/20 ,  H05K3/36

Abstract: A package for interconnecting a plurality of integrated circuit chips including a dielectric body having a plurality of intersecting planes and a plurality of metallized interconnection patterns located thereon. Conductive interconnecting lines connected to at least some of said metallized patterns located on different intersecting planes provide inter-plane electrical continuity, and input/output connectors connect to at least one of the metallized patterns for connecting to the outside world.